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QDPAK's top-side thermal path allows the PCB and semiconductor domains to be managed separately, unlocking more power in less space June 9, 2026 Nexperia has launched 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging for electric vehicle (EV) and industrial power conversion, enabling up to 3 kW more output power than conventional D2PAK-7 devices at comparable thermal limits. The portfolio

Home/ Semiconductor Component/ Automotive Electronics/Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Infineon Expands 750V CoolSiC Portfolio with H-DPAK Devices Vaishali Chauhan June 8, 2026 2 minutes read Power conversion architectures in automotive and industrial applications are evolving rapidly, placing new demands on switching topologies, thermal management, and system integ