Semiconductor News & Analysis Feed

Nexperia's introduction of 1200V SiC MOSFETs in QDPAK packaging represents a significant advancement in power semiconductor technology, specifically addressing critical thermal management challenges in high-power applications. This development targets key sectors including electric vehicles, industr

Nexperia has introduced 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging, targeting electric vehicle (EV) and industrial power conversion applications. The new devices deliver up to 3 kW more output power than conventional D2PAK-7 packages under similar thermal conditions, thanks to QDPAK's t

Infineon has launched new H-DPAK half-bridge devices based on 750V CoolSiC™ G2 technology, expanding its portfolio for automotive and industrial power semiconductor applications. The device features a top-side cooled package that integrates a complete unidirectional half-bridge stage, offering enhan