Semiconductor News & Analysis Feed
246 articles
2026-07-10
tomshardware.com
2026-07-10
Luke James
Nanya Technology plans capex of more than TW$200 billion ($6.2 billion) in 2027, roughly four times its budget for this year.
2026-07-10
www.moomoo.com
2026-07-10
Moomoo
2026-07-10
stocktwits.com
2026-07-10
Stocktwits
2026-07-10
finance.yahoo.com
2026-07-10
Yahoo Finance
2026-07-10
www.tradingview.com
2026-07-10
TradingView
2026-07-10
www.igorslab.de
2026-07-10
igor´sLAB
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-10
digitimes.com
2026-07-10
Nanya Technology posted record quarterly profit after a more than 60% rise in average DRAM selling prices lifted its gross margin to 79.5%, with the Taiwanese memory chipmaker expecting prices and margins to improve further in the second half.
2026-07-10
digitimes.com
2026-07-10
High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
2026-07-09
www.etf.com
2026-07-09
ETF.com
2026-07-09
digitimes.com
2026-07-09
CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into high-bandwidth memory (HBM). This eases concerns that Chinese suppliers are about to challenge the dominance of Samsung Electronics, SK Hynix, and Micron in AI memory.
2026-07-09
digitimes.com
2026-07-09
CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade 17nm production, expand DDR5, and develop HBM for AI servers and high-performance computing.
2026-07-09
digitimes.com
2026-07-09
Micron Technology said July 9 it is raising its planned US fab and technology investment to more than $250 billion through 2035, citing surging demand for memory driven by AI. The company said the increase supports its long-term goal of producing 40% of its DRAM output domestically.
2026-07-08
www.ig.com
2026-07-08
ig.com
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Memory and storage stocks have soared in 2026 as AI-driven demand for DRAM and HBM outpaces supply, but the ral
2026-07-08
www.ig.com
2026-07-08
ig.com
Memory and storage stocks have soared in 2026 as AI-driven demand for DRAM and HBM outpaces supply, but the rally may not be over yet.
Memory chips have always been a boom-and-bust business, but this year's move looks different in scale. Samsung Electronics said this week that it expects second-quarter operating profit of approximately 89.4 trillion won (around $59 billion) — roughly 19 times hig
2026-07-08
biz.chosun.com
2026-07-08
Chosunbiz
By
Hwang Min-gyu
Published 2026.07.08. 15:17
China CXMT corporations logo. /Courtesy of Reuters Yonhap
An analysis of the securities registration statement submitted by CXMT for a listing on Shanghai's STAR Market found no content related to capital expenditures for high bandwidth memory (HBM). China's drive into HBM, cited as a mid- to long-term threat to Samsung Electronics and SK hynix, is n
2026-07-08
wccftech.com
2026-07-08
Wccftech
In a major development that suggests things are moving ahead at a fairly rapid pace, Apple has apparently begun testing DRAM from CXMT ahead of a possible inclusion in its expansive product portfolio.
According to the Financial Times, Apple is currently testing DRAM products from China's CXMT, hinting at a growing probability of the Chinese DRAM giant becoming a part of Apple's sprawling supply c
2026-07-07
www.tomshardware.com
2026-07-07
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck
News
By Etiido Uko
Published 2 days ago
The patent was filed 18 months ago, and there's no further indication of ongoing development
(Image credit: Intel)
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2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-07
news.google.com
2026-07-07
EE Times Asia