Semiconductor News & Analysis Feed

246 articles
2026-06-25
futurumgroup.com 2026-06-25 The Futurum Group
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2026-06-25
www.manilatimes.net 2026-06-25 The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com 2026-06-25 marketscreener.com
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2026-06-25
news.google.com 2026-06-25 Stock Titan
2026-06-25
www.globenewswire.com 2026-06-25 GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
finance.yahoo.com 2026-06-25 Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries. Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips Applied Materials, Inc. Thu, June 25, 2026 at 6:00 AM PDT 6 min read AMAT -3.33% Trade AMAT on Coinbase Trading disclosure Applied Materials, Inc. Innovations spanning DRAM and advanced packaging enable the
2026-06-25
tomshardware.com 2026-06-25 Anton Shilov
Micron has signed 16 LTAs with various customers to supply DRAM and NAND worth $100 billion.
2026-06-25
www.businesskorea.co.kr 2026-06-25 Businesskorea
Samsung held first place in global DRAM revenue share at 38% in Q1, while SK hynix fell to 29% Samsung Electronics' DDR5 DRAM. (Photo provided by Samsung Electronics) Samsung Electronics maintained its leading position in the DRAM market for two consecutive quarters. This is interpreted as the result of significantly increasing production capacity in response to the memory shortage triggered by b
2026-06-25
seekingalpha.com 2026-06-25 Seeking Alpha
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2026-06-25
en.sedaily.com 2026-06-25 Seoul Economic Daily
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2026-06-25
www.investing.com 2026-06-25 Investing.com
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2026-06-25
news.futunn.com 2026-06-25 富途牛牛
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2026-06-25
biz.chosun.com 2026-06-25 Chosunbiz
By  Jeong Du-yong Published 2026.06.25. 12:34 Global DRAM market share trend. /Courtesy of Counterpoint Research In the global memory market, Samsung Electronics kept the No. 1 spot in DRAM and NAND flash. SK hynix maintained the lead in the high bandwidth memory (HBM) market with a majority share. Chinese companies increased their shares in DRAM and NAND, speeding up the chase. According to mem
2026-06-25
digitimes.com 2026-06-25
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.
2026-06-25
wccftech.com 2026-06-25 Wccftech
Qualcomm is unveiling its breakthrough for the AI data center market called HBC (High-Bandwidth Compute), to break the memory wall. At its Investors Day 2026, Qualcomm unveiled HBC under its Dragonfly brand, an innovative technology that aims to offer a major boost in memory capacity and bandwidth. The HBC architecture deploys a purpose-built & near-memory solution that bonds compute with boosted
2026-06-24
finance.yahoo.com 2026-06-24 Yahoo Finance
SK Hynix Targets $29B Nasdaq Offering – DRAM Jumps Over 4% Ahead Of Micron's Report SK Hynix Targets $29B Nasdaq Offering – DRAM Jumps Over 4% Ahead Of Micron's Report · Stocktwits Yuvraj Malik Wed, June 24, 2026 at 3:03 AM PDT 2 min read 000660.KS +0.98% MU -1.12% Trade MU on Coinbase Trading disclosure SK Hynix will issue 17.79 million new shares to back a Nasdaq listing of ADRs on July 10. DR
2026-06-24
www.moomoo.com 2026-06-24 Moomoo
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2026-06-24
digitimes.com 2026-06-24
SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a sharp profitability reversal makes the broader memory market too profitable to ignore.
2026-06-24
digitimes.com 2026-06-24
Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.
2026-06-24
digitimes.com 2026-06-24
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources reported. According to ET News, the DRAM subcommittee completed its review, and the JEDEC board gave final approval, positioning the standard to influence AI semiconductor cost structures and substrate choices.