Semiconductor News & Analysis Feed

246 articles
2026-06-21
tomshardware.com 2026-06-21 Mark Tyson
GMKtec's dramatically redesigned EVO-X3 'Strix Halo' Mini PC gets Lisa Su’s signature of approval.
2026-06-21
finance.yahoo.com 2026-06-21 Yahoo Finance
SK Hynix (KOSE:A000660) Ships HBM4E DRAM To AI Customers Bailey Pemberton Sat, June 20, 2026 at 8:13 PM PDT 3 min read 000660.KS -11.55% NVDA -0.97% Trade NVIDIA on Coinbase Trading disclosure Get insights on thousands of stocks from the global community of over 7 million individual investors at Simply Wall St. SK hynix has begun shipping its next generation HBM4E DRAM for AI customers, introduc
2026-06-20
www.tradingview.com 2026-06-20 TradingView
News / GuruFocus / Micron Stock Gets Stunning Double Upgrade -- Analysts Predict Triple-Digit DRAM Surge Micron Stock Gets Stunning Double Upgrade -- Analysts Predict Triple-Digit DRAM Surge Less than 1 min read MU +6.82% Micron MU stock could stay in focus after Stifel and Wedbush lifted their price targets on expectations that memory pricing and AI demand will keep improving. Stifel raised i
2026-06-20
www.gurufocus.com 2026-06-20 GuruFocus
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2026-06-18
tomshardware.com 2026-06-18 Anton Shilov
Apple's Tim Cook says that Apple can no longer 'shield' its customers from increased prices of DRAM and NAND memory.
2026-06-18
tomshardware.com 2026-06-18 Anton Shilov
CCP directives can be lifebuoy for Chinese producers of DRAM modules and solid-state drives as domestic memory makers may be obliged to support the module industry.
2026-06-18
wccftech.com 2026-06-18 Wccftech
SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com 2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-17
tomshardware.com 2026-06-17 Zhiye Liu
Chinese memory brands Gloway and KingBank have begun using homemade chips to produce DDR5 memory kits in lieu of Samsung, Micron, or SK hynix DRAM.
2026-06-16
wccftech.com 2026-06-16 Wccftech
The memory requirements of experiencing the entire Siri AI features suite will eventually force Apple to introduce a minimum of 12GB LPDDR5X RAM for its iPhone 18 lineup, but more importantly, is how increased demand for these devices will contribute to the existing memory crisis while making a handful of suppliers wealthy in the process.
2026-06-16
digitimes.com 2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com 2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
tomshardware.com 2026-06-16 Anton Shilov
AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.
2026-06-16
wccftech.com 2026-06-16 Wccftech
The compact space inside smartphones makes it difficult to adopt High Bandwidth Memory (HBM), not to mention the thermal problem, but a rumor claims that Chinese smartphone brands have a custom-made Low Latency Wide DRAM (LLW) that adopts a similar integrated design as the aforementioned technology. While the design isn’t “true HBM,” it aims to resolve the performance bottleneck issue that LPDDR R
2026-06-15
www.msn.com 2026-06-15 MSN
・The U.S. peace deal with Iran sent global markets higher on Monday. ・MU stock gained 8% in the premarket, while the Roundhill Memory ETF (DRAM) advanced 6%. ・Micron is scheduled to report its fiscal third-quarter results on June 24. Micron stock rallied 8% in the premarket session on Monday, leading gains in the red-hot memory chip stocks, after U.S. President Donald Trump and Iranian official
2026-06-15
stocktwits.com 2026-06-15 Stocktwits
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2026-06-15
www.tradingview.com 2026-06-15 TradingView
News / Stocktwits / MU Stock Leads Memory Chip Rally Amid Iran Relief – DRAM Surges 6% As SK Hynix, Samsung Gain MU Stock Leads Memory Chip Rally Amid Iran Relief – DRAM Surges 6% As SK Hynix, Samsung Gain 2 min read MU −1.43% KEY POINTS: The U.S. peace deal with Iran sent global markets higher on Monday. MU stock gained 8% in the premarket, while the Roundhill Memory ETF (DRAM) advanced 6%. Micro
2026-06-15
finance.yahoo.com 2026-06-15 Yahoo Finance
MU Stock Leads Memory Chip Rally Amid Iran Relief – DRAM Surges 6% As SK Hynix, Samsung Gain MU Stock Leads Memory Chip Rally Amid Iran Relief – DRAM Surges 6% As SK Hynix, Samsung Gain · Stocktwits Yuvraj Malik Mon, June 15, 2026 at 2:24 AM PDT 3 min read MU +8.13% 005930.KS +4.50% 000660.KS +6.42% STX +9.52% SNDK +3.98% Explore stocks on Coinbase Trading disclosure The U.S. peace deal with Iran
2026-06-15
digitimes.com 2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con