Semiconductor News & Analysis Feed
315 articles
2026-05-28
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2026-05-28
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Synopsys reported divergent regional performance in the second quarter, with China showing sequential growth while North America and Europe declined, as demand patterns for semiconductor design tools and simulation software remained uneven across end markets.
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2026-05-28
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2026-05-28
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Synopsys said the rise of agentic artificial intelligence and the integration of Ansys are creating new growth opportunities across electronic design automation (EDA) and simulation software, as semiconductor and industrial customers adopt more complex...
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2026-05-28
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2026-05-28
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Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design automation (EDA), hardware-assisted verification, and intellectual property...
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2026-05-28
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2026-05-28
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Synopsys raised its fiscal 2026 revenue target after reporting a 42% year-over-year rise in second-quarter sales, driven by continued demand for AI-related chip design tools and verification systems.
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2026-05-28
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2026-05-28
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Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNews reported,...
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2026-05-27
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2026-05-27
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TSMC chairman and CEO C.C. Wei personally addressed employees at a company-wide meeting on the morning of May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
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2026-05-27
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2026-05-27
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The agreement between Qualcomm and ByteDance positions the former for large-scale AI ASIC demand from the latter, as reported by Bloomberg, but market viability remains uncertain amid intense AI chip competition, evolving China procurement...
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2026-05-27
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2026-05-27
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SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
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2026-05-27
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Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's...
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2026-05-27
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2026-05-27
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Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
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2026-05-26
digitimes
When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners and the island's broader semiconductor ecosystem. The goal, she said, was to help secure a long-term supply of advanced...
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2026-05-26
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2026-05-26
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Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production...
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2026-05-26
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2026-05-26
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Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing strong demand for high-efficiency power solutions in AI servers. The company is...
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2026-05-26
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2026-05-26
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Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV technologies to reduce energy consumption per wafer at the process level,...
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2026-05-26
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2026-05-26
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As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
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2026-05-26
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2026-05-26
digitimes
As the global semiconductor industry approaches the physical limits of transistor scaling, Huawei has proposed a new framework for the post-Moore era through its recently introduced "Tau (τ) Law" and a related time-scaling theory.
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2026-05-26
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2026-05-26
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Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs...
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2026-05-26
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2026-05-26
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As Micron Technology's decision to restart large-scale DDR4 production in the US grabs global attention, memory-chip executives and analysts say the move is less a revival of aging technology than a strategic reshuffling of supply aimed at safeguarding...
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