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Trending Technologies
EUV166 3nm136 AI chips61 HBM58 AI58 GPU53 DRAM50 NAND flash25 memory chips25 advanced packaging18 AI infrastructure18 2nm16 semiconductor15 NAND12 data center12
2026-05-07
Intel targets entry-level advanced packaging, draws interest from Google and Amazon - digitimes
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www.digitimes.com 2026-05-07 digitimes
Over the past decade, market assessments of Intel have largely been confined to a single lens: execution in advanced process technology. By that metric, Intel has struggled, with delays in 10nm and setbacks at the 7nm node, leading to the loss of Apple's chip...The article requires paid subscription.Subscribe Now
IntelAdvanced PackagingSemiconductor ManufacturingChip TechnologyGoogleAmazonWafer FabSemiconductor Industry
2026-05-06
VIS joins CoWoS chain with TSMC-backed Singapore interposer foundry - digitimes
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www.digitimes.com 2026-05-06 digitimes
Vanguard International Semiconductor (VIS) said on May 5 that it has secured support from TSMC for a new interposer foundry line at its 12-inch Singapore fab, alongside a broader push into the CoWoS supply chain. The company said the move will accelerate...The article requires paid subscription.Subscribe Now
Semiconductor ManufacturingPackaging and TestingCoWoSTSMCSingaporeInterposerAdvanced PackagingSemiconductor Supply Chain
2026-05-06
SoftBank, Intel target HBM limits with 9-layer memory - digitimes
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www.digitimes.com 2026-05-06 digitimes
SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints of high-bandwidth memory.The article requires paid subscription.Subscribe Now
2026-05-05
South Korea eyes memory-led AI order against Nvidia - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
Google's TPU push hits Nvidia's neocloud grip - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
Another Qualcomm exec joins Intel to lead PC and physical AI unit - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
As Nvidia goes to zero in China, Beijing races to fill the void - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
Univacco eyes 2027 Vietnam plant ramp-up for CPO and advanced packaging materials - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
Analysis: CoWoS crunch and MediaTek's hire raise a bigger question — can Intel deliver? - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-05
SK Hynix weighs memory plant shift as HBM demand outlook changes - digitimes
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www.digitimes.com 2026-05-05 digitimes
2026-05-04
ADT lands US AI chip deal using Samsung 4nm - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
Samsung strike exposes AI-era pay divide, raises HBM supply risks - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
TSMC’s 3nm crunch will keep Apple Mac supply constrained until 2nm ramps up - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
L&T Semiconductor Technologies joins imec automotive chiplet program, aiming to shape global vehicle electronics - digitimes
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www.digitimes.com 2026-05-04 digitimes
2026-05-04
SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand - digitimes
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www.digitimes.com 2026-05-04 digitimes