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The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.

EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction.

Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status se