Semiconductor News & Analysis Feed
421 articles
2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
ROHM has developed the TSC3PAK, a top-side cooling package for SiC MOSFETs aimed at high-voltage power conversion in electric vehicles and industrial systems. The 14.00 × 18.58 × 3.50 mm surface-mount package is designed to combine automated mounting with heat dissipation closer to conventional through-hole packages such as TO-247-4L.
2026-06-12
digitimes.com
2026-06-12
China's two leading memory chipmakers, CXMT and YMTC, are moving closer to the capital market, putting the country's memory industry back under the semiconductor spotlight.
2026-06-12
digitimes.com
2026-06-12
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on imports leaves the country exposed to cost, supply, and security risks.
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com
2026-06-12
A strike by South Korea's ready-mix concrete transport union is disrupting major semiconductor construction sites and raising concerns about wider industrial spillovers. If the stoppage continues, delays could spread beyond building projects and affect production schedules that matter to global technology supply chains and investors.
2026-06-12
digitimes.com
2026-06-12
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-12
digitimes.com
2026-06-12
Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related chips, and rising use of advanced packaging capacity. The result suggests continued momentum in global semiconductor supply chains, with implications for networking, memory, and high-performance computing markets worldwide.
2026-06-12
tomshardware.com
2026-06-12
Zhiye Liu
Graphics card manufacturer Manli adds new GeForce RTX 3060 and GeForce RTX 3050 SKUs to its portfolio.
2026-06-11
www.automotivepowertraintechnologyinternational.com
2026-06-11
Automotive Powertrain Technology International
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, enabling automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliabi
2026-06-11
www.reuters.com
2026-06-11
Reuters
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2026-06-11
www.tradingview.com
2026-06-11
TradingView
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KKR launches $10 billion AI infrastructure company with Nvidia, Vistra
KKR launches $10 billion AI infrastructure company with Nvidia, Vistra
RefinitivLess than 1 min read
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2026-06-11
seekingalpha.com
2026-06-11
Seeking Alpha
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2026-06-11
wccftech.com
2026-06-11
Wccftech
With multiple supply chain reports focusing on Intel's EMIB-T chip packaging technology, analyst Ming-Chi Kuo has shared that TSMC's next-generation packaging technology, CoPoS, will enter mass production in 2028. CoPoS, short for chip-on-panel-on-substrate, seeks to overcome the limitations of the current CoWoS (chip-on-wafer-on-substrate) packaging technology by increasing the area on which the
2026-06-11
www.wsj.com
2026-06-11
WSJ
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2026-06-11
www.wsj.com
2026-06-11
WSJ
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2026-06-11
cnycentral.com
2026-06-11
WSTM
CLAY. N.Y. — Micron’s planned semiconductor manufacturing campus in Clay reached another major milestone Wednesday with the announcement that Bechtel has been selected to lead the next phase of construction.
Micron said Bechtel will serve as the engineering, procurement and construction partner for the first phase of its memory manufacturing complex at White Pine Commerce Park in Onondaga County.
2026-06-11
digitimes.com
2026-06-11
Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.
2026-06-11
semiengineering.com
2026-06-11
Brian Bailey
It depends on what those models are used, which also can have a big impact on the cost.
2026-06-11
digitimes.com
2026-06-11
Andy Hock, chief strategy officer at Cerebras Systems, walked onto the Main Stage at SuperAI Singapore 2026 on Wednesday carrying the company's Wafer Scale Engine — the physical chip itself — and held it up for an audience of 10,000 before placing it next to a slide showing it to scale against Nvidia's latest B200 platform. The size difference was stark.