Semiconductor News & Analysis Feed
428 articles
2026-06-11
wccftech.com
2026-06-11
Wccftech
With multiple supply chain reports focusing on Intel's EMIB-T chip packaging technology, analyst Ming-Chi Kuo has shared that TSMC's next-generation packaging technology, CoPoS, will enter mass production in 2028. CoPoS, short for chip-on-panel-on-substrate, seeks to overcome the limitations of the current CoWoS (chip-on-wafer-on-substrate) packaging technology by increasing the area on which the
2026-06-11
www.wsj.com
2026-06-11
WSJ
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2026-06-11
www.wsj.com
2026-06-11
WSJ
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2026-06-11
cnycentral.com
2026-06-11
WSTM
CLAY. N.Y. — Micron’s planned semiconductor manufacturing campus in Clay reached another major milestone Wednesday with the announcement that Bechtel has been selected to lead the next phase of construction.
Micron said Bechtel will serve as the engineering, procurement and construction partner for the first phase of its memory manufacturing complex at White Pine Commerce Park in Onondaga County.
2026-06-11
semiengineering.com
2026-06-11
Brian Bailey
It depends on what those models are used, which also can have a big impact on the cost.
2026-06-11
digitimes.com
2026-06-11
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials engineering. The shift matters far beyond one company, because AI demand is increasing worldwide and is expected to influence data centers, device costs, energy use, and the pace of technology development.
2026-06-11
eetimes.com
2026-06-11
Pablo Valerio
Gartner's VP analyst David Gonzalez shares strategies for profitability and technology in supply chain management.
2026-06-11
digitimes.com
2026-06-11
Congressional Republicans are urging stronger exclusion orders in the ongoing Section 337 investigation tied to TSMC's advanced-node chips, while the company reiterates compliance with local laws and highlights ongoing legal uncertainty in its quarterly filing.
2026-06-11
digitimes.com
2026-06-11
Andy Hock, chief strategy officer at Cerebras Systems, walked onto the Main Stage at SuperAI Singapore 2026 on Wednesday carrying the company's Wafer Scale Engine — the physical chip itself — and held it up for an audience of 10,000 before placing it next to a slide showing it to scale against Nvidia's latest B200 platform. The size difference was stark.
2026-06-11
digitimes.com
2026-06-11
Largan Precision is accelerating its push into CPO-related optical components, with chairman Adam Lin revealing that the company is building its first automated pilot line at a new Taiwan facility, scheduled to be ready before September 2026.
2026-06-11
digitimes.com
2026-06-11
The Czech Republic and other Central and Eastern European countries have gradually become emerging markets for Taiwanese investment and exports. This follows the donation of vaccines during the Covid-19 pandemic from the Czech Republic to Taiwan, underscoring the shared values of democracy and freedom between the two.
2026-06-11
digitimes.com
2026-06-11
Astera Labs expects its Scorpio switch-chip business to become its largest revenue contributor by the end of 2026, marking a shift for the cloud AI connectivity chip supplier as demand grows for scale-up infrastructure in AI clusters.
2026-06-11
digitimes.com
2026-06-11
Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production could shift to Intel, and some AMD products could be made by Samsung Electronics. TSMC CFO Wendell Huang recently told the media that global inflation and overseas fab expansion have indeed pushed up operating c
2026-06-11
digitimes.com
2026-06-11
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.
2026-06-11
digitimes.com
2026-06-11
Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future of AI networking, could face further delays as manufacturing yields remain inconsistent.
2026-06-11
digitimes.com
2026-06-11
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure aimed at activating assets and focusing on its core business. It is also intended to improve the group's capital allocation efficiency, optimize its balance sheet, and boost earnings per share (EPS).
2026-06-11
digitimes.com
2026-06-11
Taiwan's export growth has accelerated to its strongest pace in nearly 16 years on the back of AI and higher prices for electronic components, drawing large amounts of capital into the stock market and other asset markets. Central bank governor Chin-Long Yang said on June 10 that Taiwan remains far from systemic risk despite concerns over surging market activity.
2026-06-11
digitimes.com
2026-06-11
Wistron ITS has officially changed its name to WITS. Chairman Ching Hsiao pointed out that the rebranding signifies the company's transition from software into the new frontier of "software-hardware integration."
2026-06-11
www.marketwatch.com
2026-06-11
MarketWatch
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2026-06-11
seekingalpha.com
2026-06-11
Seeking Alpha
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Nvidia: Vera CPU And RTX Spark Widen The Company's Growth Runway
Jun 10, 2026, 12:44 PM ETNVIDIA Corporation (NVDA) Stock, NVDA:CA Stock, ZNVD:CA StockMSFT, MSFT:CA, ZMSF:CA
, GOOG, GOOG:CA, ZGOO:CA, GOOGL, META, META:CA, ZMET:CA, AMZN, AMZN:CA, ZAMZ:CA, AVGO, AVGO:CA, ZAVG:CA
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