Semiconductor News & Analysis Feed

8596 articles
2026-05-25
www.koreaherald.com 2026-05-25 The Korea Herald
Asia strategist Mixo Das keeps Korea as Asia top pick, backs Kospi 10,000 call on AI, earnings momentum Mixo Das, JPMorgan Chase & Co. Asia equity and quant strategist. (JPMorgan Chase & Co.) JPMorgan Chase & Co. Asia equity and quant strategist Mixo Das says South Korea's stock rally still has room to run, as the artificial intelligence-driven memory cycle, earnings upgrades and governance refo
2026-05-25
intellectia.ai 2026-05-25 Intellectia AI
Nvidia's first-quarter fiscal 2027 earnings, reported on May 20, 2026, delivered yet another stunning demonstration of the company's dominance in the artificial intelligence infrastructure market. The semiconductor giant posted record revenue of $81.6 billion, representing an extraordinary 85% year-over-year increase that significantly exceeded Wall Street's expectations of $78.8 billion. Adjusted
2026-05-25
koreajoongangdaily.joins.com 2026-05-25 Korea JoongAng Daily
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2026-05-25
www.koreatimes.co.kr 2026-05-25 The Korea Times
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2026-05-25
www.businesstimes.com.sg 2026-05-25 The Business Times
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2026-05-25
www.businesstimes.com.sg 2026-05-25 The Business Times
China’s Huawei reveals chip design breakthrough amid US sanctions The company’s Ascend chip series has become increasingly central to powering Chinese artificial intelligence models Summarise Share Add BT as a preferred source Published Mon, May 25, 2026 · 10:10 AM — Updated Mon, May 25, 2026 · 01:24 PM Huawei unveiled on Monday a new principle for improving chips, noting the industry can no l
2026-05-25
www.tradingview.com 2026-05-25 TradingView
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2026-05-25
theedgemalaysia.com 2026-05-25 The Edge Malaysia
(May 25): Huawei Technologies Co said it has come up with a new pathway to shorten its gap with industry leader Taiwan Semiconductor Manufacturing Co (TSMC), potentially achieving a breakthrough in making advanced semiconductors without cutting-edge equipment. Right now there is about a five-year gap between what TSMC is capable of and what Huawei together with its manufacturing partner Semicondu
2026-05-25
www.reuters.com 2026-05-25 Reuters
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2026-05-25
www.marketscreener.com 2026-05-25 marketscreener.com
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2026-05-25
www.bloomberg.com 2026-05-25 Bloomberg.com
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2026-05-25
www.bloomberg.com 2026-05-25 Bloomberg.com
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2026-05-25
www.ad-hoc-news.de 2026-05-25 AD HOC NEWS
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2026-05-25
www.huawei.com 2026-05-25 Huawei
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2026-05-25
simplywall.st 2026-05-25 simplywall.st
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2026-05-25
digitimes.com 2026-05-25
Nvidia's structural pivot to isolate its ACIE market and AMD's US$10 billion investment in Taiwan infrastructure signal a profound realignment in the AI chip war. Both developments reflect a shared urgency to expand beyond traditional hyperscale clouds into the booming, highly lucrative global enterprise, industrial, and sovereign AI factory frontiers.
2026-05-25
digitimes.com 2026-05-25
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints, chip-scaling limits, and growing demand for faster equipment delivery.
2026-05-25
digitimes.com 2026-05-25
Nvidia's decision to sell its Vera CPU as a standalone chip could create a new source of demand for low-power DRAM, adding another pressure point to the already tight memory supply chain.
2026-05-25
digitimes.com 2026-05-25
At its earnings conference, Weltrend Semiconductor described the first quarter of 2026 as an exceptional one. Despite the period being historically slow, the company posted year-over-year and sequential growth. Nearly all major product lines demonstrated strong growth momentum, with server-related products standing out in particular. Order visibility is now expected to remain strong throughout the
2026-05-25
digitimes.com 2026-05-25
Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced Echem Materials Company and Trusval Technology, forming Advanced Pao Trusval Technology to target advanced packaging adhesive materials.