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2026-06-15
Manz Asia Successfully Delivers World's First 310mm × 310mm Panel-Level Packaging ECD Production System - Taiwan News
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www.taiwannews.com.tw 2026-06-15 Taiwan News
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Semiconductor Packaging310mm PanelECD TechnologyManz AsiaSemiconductor EquipmentPackage TechnologyAdvanced ProcessPanel-Level Packaging
2026-06-15
CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment
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digitimes.com 2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
OECD data show China-based semiconductor makers receive outsized industrial support
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digitimes.com
Industrial subsidies reached their highest level since the global financial crisis in 2023 and 2024, according to a June 2026 OECD release based on its new MAGIC database of industrial subsidies. The database tracks support received by 525 of the world's largest manufacturing groups across 15 industrial sectors from 2005 to 2024.