Semiconductor News & Analysis Feed

At the ECTC 2026 conference, High Bandwidth Memory (HBM) technology is emerging as a defining factor in the next generation of AI hardware competition. As AI models grow larger and computational demands intensify, traditional memory architectures are increasingly inadequate. HBM addresses this by ve

LG Innotek made its debut at the 2026 Electronic Components and Technology Conference (ECTC), showcasing next-generation semiconductor package substrate technologies to global industry leaders. As the world’s largest international conference on semiconductor packaging, ECTC attracted over 2,000 prof

LG Innotek announced its participation in the 2026 Electronic Components and Technology Conference (ECTC) in Orlando, Florida, where it showcased next-generation semiconductor package substrate technologies to global tech leaders. ECTC, the world's largest international conference on semiconductor p

Fujifilm presented its latest research findings in advanced semiconductor packaging at the Electronic Components and Technology Conference (ECTC 2026), held in Orlando, Florida from May 26–29, 2026. As the world’s largest international conference dedicated to semiconductor packaging technologies, EC