Semiconductor News & Analysis Feed
69 articles
2026-06-18
digitimes.com
2026-06-18
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.
2026-06-18
digitimes.com
2026-06-18
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
2026-06-18
digitimes.com
2026-06-18
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."
2026-06-18
digitimes.com
2026-06-18
Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin pla
2026-06-17
tomshardware.com
2026-06-17
Jowi Morales
Syrian users would have to deal with slow internet speeds as the undersea cable is being repaired.
2026-06-17
digitimes.com
2026-06-17
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data center deployments on another. However, during PCIM Europe 2026 in Nuremberg, Germany, industry leaders and experts discussed and dismantled thi
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has drawn skepticism from Taiwan industry sources, who say the timeline is likely premature and that the company remains focused on evaluating multiple advanced-packaging options.
2026-06-15
www.marketscreener.com
2026-06-15
marketscreener.com
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2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-13
tomshardware.com
2026-06-13
Jake Roach
The name came up a few times during our conversations at Computex. Intel has declined to comment on it.
2026-06-13
digitimes.com
2026-06-13
ITE Tech said its embedded controller chip and HDMI 2.1 retimer have been adopted by a US agentic AI computing platform, with mass production expected as early as the second half of 2026. The win could ripple through global PC supply chains, as the company prepares to serve major brand customers and ODM partners worldwide.
2026-06-12
tomshardware.com
2026-06-12
Mark Tyson
Tens of officers have been fired, and some even arrested, for abuse of the Flock license plate reader system used by police departments throughout the US, according to a new report.
2026-06-12
digitimes.com
2026-06-12
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.
2026-06-12
digitimes.com
2026-06-12
Silicon Labs is deepening its presence in India through expanded research operations and a greater commercial focus on smart infrastructure applications, even as the US-based wireless chipmaker prepares for an acquisition by Texas Instruments.
2026-06-11
tomshardware.com
2026-06-11
Luke James
Meta has finished separating its operations from Manus, the Chinese-founded agentic AI startup it acquired for roughly $2 billion in December.
2026-06-11
tomshardware.com
2026-06-11
Aaron Klotz
Right to Repair activist Louis Rossman threatens to sue Samsung after the SSD maker failed to replace his dead 990 Pro 4TB SSD under warranty.
2026-06-11
digitimes.com
2026-06-11
TSS Semiconductor Alliance, a group of 18 small and medium-sized Taiwanese suppliers of semiconductor materials, components and equipment, is preparing to form a third cohort as members seek to expand their role in global chip supply chains.
2026-06-10
cepa.org
2026-06-10
Center for European Policy Analysis (CEPA)
The European Commission’s new Digital Sovereignty package proposes a Chips Act 2.0 that would pour taxpayer money into a sovereign artificial intelligence chip factory. A wise strategy would instead build on Europe’s existing semiconductor strengths and boost the continent’s AI appetite.
Europe’s first Chips Act, from 2022, aimed to increase the EU’s global market share to 20% by 2030, up from