Semiconductor News & Analysis Feed
72 articles
2026-05-30
digitimes.com
2026-05-30
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical communication modules as a future driver of revenue and profits.
2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-29
tomshardware.com
2026-05-29
Aaron Klotz
Linux developers are discussing removing x32 ABI from the Linux kernel; a hybrid x32/64-bit mode that was never widely adopted by software developers.
2026-05-29
dig.watch
2026-05-29
Digital Watch Observatory
Home | Updates | European Commission prepares Chips Act 2.0 to boost semiconductor resilience
Leading-edge semiconductors are central to the initiative, with applications across defence, AI, automotive systems and high-performance computing.
The European Commission is preparing a Chips Act 2.0 aimed at strengthening Europe’s semiconductor resilience, reducing strategic dependencies, and supporti
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa, as the electronics manufacturer looks beyond AI servers for its next phase of growth.
2026-05-28
digitimes.com
2026-05-28
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.
2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-28
digitimes.com
2026-05-28
Chunghwa Precision Test Tech. completed its board election at the 2026 annual shareholders' meeting on May 27 as the semiconductor test interface maker prepared for rising AI chip demand and a planned capacity expansion over the next two to three years. The company announced the reappointment of four board members and the retention of three independent directors as it outlined near-term production
2026-05-28
digitimes.com
2026-05-28
Qualcomm has reportedly landed more than one ASIC customer, with a separate project for a US cloud service provider also taking shape, according to industry sources. The development follows reports from Bloombergand other media that ByteDance, the developer of TikTok, is Qualcomm's first major client for its custom chip push.
2026-05-26
digitimes.com
2026-05-26
Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth memory (HBM) in 2027, a move that could tighten the supply of general-purpose DRAM as memory makers shift more production toward higher-value AI server products.
2026-05-25
english.nepalnews.com
2026-05-25
Nepalnews.com
english.nepalnews.com
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2026-05-22
www.manufacturingdive.com
2026-05-22
Manufacturing Dive
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2026-05-22
news.fundsforngos.org
2026-05-22
fundsforNGOs News
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2026-05-22
overclock3d.net
2026-05-22
OC3D
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2026-05-22
www.telecompaper.com
2026-05-22
Telecompaper
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2026-05-22
www.telecompaper.com
2026-05-22
Telecompaper
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2026-05-21
www.manilatimes.net
2026-05-21
The Manila Times
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2026-05-21
www.tomshardware.com
2026-05-21
Tom's Hardware
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2026-05-21
www.minichart.com.sg
2026-05-21
Minichart
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