Semiconductor News & Analysis Feed
3071 articles
2026-06-18
finance.yahoo.com
2026-06-18
Yahoo Finance
QUALCOMM (QCOM) Is Up 11.4% After Launching Custom AI Data Center Silicon With a Hyperscaler
Sasha Jovanovic
Wed, June 17, 2026 at 11:09 PM PDT 3 min read
QCOM
+6.17%
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In recent weeks, Qualcomm has moved beyond its smartphone roots by launching a custom AI data center silicon program with a leading hyperscaler, expanding collaborations in XR, edge AI, and
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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2026-06-18
kfgo.com
2026-06-18
The Mighty 790 KFGO
SEOUL, June 18 (Reuters) – SK Hynix said on Thursday it has shipped samples of its latest high-bandwidth memory (HBM) chips to major customers, as the South Korean chipmaker seeks to strengthen its position in the fast-growing AI semiconductor market.
The next-generation 12-layer HBM4E chip reaches speeds of up to 16 gigabits per second per pin and offers over 20% better power efficien
2026-06-18
www.reuters.com
2026-06-18
Reuters
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2026-06-18
www.reuters.com
2026-06-18
Reuters
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2026-06-18
www.reuters.com
2026-06-18
Reuters
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2026-06-18
www.benzinga.com
2026-06-18
Benzinga
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2026-06-18
wccftech.com
2026-06-18
Wccftech
SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities.
The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters.
The HBM4E memory will play a
2026-06-18
news.google.com
2026-06-18
University of Hawaii System
2026-06-18
en.yna.co.kr
2026-06-18
Yonhap News Agency
SEOUL, June 18 (Yonhap) -- SK hynix Inc. said Thursday it has begun shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, to major global customers, marking another step in the race to supply next-generation memory for artificial intelligence (AI) applications.
"The company was able to deliver samples of the 12-stack HBM4E on schedule thanks to its advanced HBM deve
2026-06-18
digitimes.com
2026-06-18
Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising artificial intelligence infrastructure spending lifting most of the sector's 27 tracked companies to double-digit year-on-year gains.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-18
digitimes.com
2026-06-18
Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin platform prepares for volume shipments in the second half of 2026. Industry sources said Winbond will align NOR flash shipments with customer rollout schedules and is expected to win a major share on the Vera Rubin pla
2026-06-18
digitimes.com
2026-06-18
Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas in
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com
2026-06-18
Demand in the passive components market is recovering significantly, lifting operating momentum at Taiwan's two leading suppliers, Yageo and Walsin Technology. Average book-to-bill ratios at both companies have risen above 1.3, placing industry conditions near their highest levels in recent years and reinforcing expectations for sequential growth through 2026.
2026-06-18
digitimes.com
2026-06-18
Backlight module maker Darwin held its shareholders' meeting on June 17, 2026, and said it remains cautiously optimistic about 2026 revenue as its new businesses continue to gain traction. The company cited fresh commercial display orders in the US market and said organ-chip partner Anivance AI is also listed on an "Nvidia backdrop," adding momentum to its medical technology push.
2026-06-18
digitimes.com
2026-06-18
In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is preparing to raise product prices because memory and storage costs have surged to a point Apple can no longer absorb. He said Apple has spent the past stretch trying to shield customers from these cost increases, but the situation has become "unsustainable."
2026-06-18
digitimes.com
2026-06-18
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.