Semiconductor News & Analysis Feed
1007 articles
2026-05-27
www.geneonline.com
2026-05-27
geneonline.com
Entegris and JSR Corporation/Inpria Corporation announced a non-exclusive cross-licensing agreement pertaining to extreme ultraviolet (EUV) lithography. The agreement involves the licensing of intellectual property related to EUV lithography technology.
The cross-licensing agreement allows both companies to utilize each other’s patents in the field of EUV lithography. This arrangement is non-excl
2026-05-27
www.thailand-business-news.com
2026-05-27
Thailand Business News
www.thailand-business-news.com
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2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters,marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.stocktitan.net
2026-05-27
Stock Titan
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2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
marklapedus.substack.com
2026-05-27
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Europe Launches New Chip/Packaging R&D Projects
These projects include GaN/SiC packaging, quasi-monolithic integration, 3D qub
2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
news.google.com
2026-05-27
Gizmochina
2026-05-27
www.reuters.com
2026-05-27
Reuters
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
Visit ROHM at booth 318 in hall 9
Demonstrating cutting edge power semiconductor technologies.
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Santa Clara, CA and Willich/Nuremberg, Germany, May 26, 2026 (GLOBE NEWSWIRE) --
2026-05-27
www.taiwannews.com.tw
2026-05-27
Taiwan News
www.taiwannews.com.tw
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2026-05-27
ca.finance.yahoo.com
2026-05-27
Yahoo! Finance Canada
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2026-05-26
www.reuters.com
2026-05-26
Reuters
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2026-05-26
www.reuters.com
2026-05-26
Reuters
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