Semiconductor News & Analysis Feed
993 articles
2026-06-30
www.datacenterdynamics.com
2026-06-30
Data Center Dynamics
US chipmaker Onsemi has acquired Synaptics in an all-stock transaction valued at around $7 billion.
The deal is expected to close by mid-2027, subject to approval from Synaptics stockholders.
– Onsemi
In a statement, Onsemi said that adding Synaptics’ differentiated Edge AI compute franchise will allow it to extend its capabilities beyond power and sensing to intelligent systems, “delivering gr
2026-06-30
www.nvidia.com
2026-06-30
NVIDIA
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2026-06-30
tomshardware.com
2026-06-30
Anton Shilov
Meta develops its custom Vistara CXL memory expander to use DDR4 memory with new servers running AMD EPYC 'Turin' processors.
2026-06-30
www.reuters.com
2026-06-30
Reuters
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2026-06-30
euobserver.com
2026-06-30
EUobserver
Stakeholder
Proposed Chips Act 2.0 fortifies Europe’s electronics ecosystem
By Alison James, Brussels, 30 June 2026 10:18
Three years ago, the European Union adopted the European Chips Act.
It marked an important first step in enabling funding for first-of-a-kind semiconductor’s research, development and production.
It also laid the foundations for emerging advanced packaging capabilities as s
2026-06-30
www.opensourceforu.com
2026-06-30
Open Source For You
Blogs
SUSE, Openchip Partner To Build Europe’s First Digitally Sovereign RISC-V Stack
By Jiya Jay Singh -
June 30, 2026
0
10
SUSE Logo (PRNewsFoto/SUSE)
SUSE and Openchip have signed an MoU to native-certify enterprise software on European-designed RISC-V accelerators, offering an open alternative to overseas chip monopolies.
SUSE, an open-source enterprise software group, and Openchip, a Spanis
2026-06-30
www.streetinsider.com
2026-06-30
StreetInsider
www.streetinsider.com
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2026-06-30
biz.chosun.com
2026-06-30
Chosunbiz
By
Jeong Du-yong
Published 2026.06.30. 15:27
Image of HANMI Semiconductor's 2.5D TC Bonder 40 equipment./Courtesy of HANMI Semiconductor
HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly
2026-06-30
digitimes.com
2026-06-30
Apple's next iPhone Pro lineup could be heading toward one of its sharpest pricing tests in years, as surging memory costs threaten to raise hardware expenses just as the company pushes deeper into on-device AI.
2026-06-30
www.reuters.com
2026-06-30
Reuters
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2026-06-30
www.ad-hoc-news.de
2026-06-30
AD HOC NEWS
JSR, JP3306600005
The ESCAPSEEK series from JSR Corp. - photoresist chemistry pushes EUV boundaries
Veröffentlicht: 30.06.2026 um 01:10 Uhr, Redaktion AD HOC NEWS, Redaktionelle Verantwortung: Rafael Müller (Chefredaktion)
The ESCAPSEEK series from JSR Corp. targets demanding EUV lithography steps with tailored photoresist chemistry for advanced semiconductor nodes. This specialist line keeps the
2026-06-30
www.eenewseurope.com
2026-06-30
eeNews Europe
Samsung Electronics and SK hynix are backing a new South Korea chip hub with a combined 800 trillion won investment plan aimed at expanding memory production for the AI infrastructure market. The plan, announced with President Lee Jae Myung in Seoul on 29 June, centres on four new semiconductor fabs in the country’s southwest, with each company expected to build two facilities.
2026-06-29
eetimes.com
2026-06-29
If Europe wants true defense resilience, it must reduce its dependence on big foreign tech ecosystems.
2026-06-29
siliconcanals.com
2026-06-29
Silicon Canals
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2026-06-29
www.reuters.com
2026-06-29
Reuters
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2026-06-29
channellife.co.uk
2026-06-29
ChannelLife UK
VIRTUALISATION
DATA PROTECTION
DC
SUSE & Openchip back European RISC-V software stack
Mon, 29th Jun 2026
SEAN MITCHELL
Publisher
SUSE and Openchip have signed a memorandum of understanding to develop a European RISC-V hardware and open source software stack, centred on software support for processors designed in Europe.
The work will focus on tuning SUSE Linux and Kubernetes products for Openchi
2026-06-29
www.eenewseurope.com
2026-06-29
eeNews Europe
The European Commission has approved €76 million in German State aid for QuantumDiamonds GmbH to build what is expected to be the EU’s first production facility for quantum sensor-based semiconductor testing equipment in Munich. The project is designed to strengthen Europe’s semiconductor supply chain and support the goals of both the European Chips Act and the proposed Chips Act 2.0.
2026-06-29
www.reuters.com
2026-06-29
Reuters
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2026-06-29
www.digitaltoday.co.kr
2026-06-29
디지털투데이
Industry
Applied Materials expands packaging equipment lineup to boost HBM, chiplet yields
AI Summary
Applied Materials unveiled six new semiconductor manufacturing tools spanning advanced packaging and DRAM processes, the company said on Sunday. It said AI computing faces a “memory wall” as bandwidth and capacity lag growing model sizes and data throughput, driving demand for high-bandwidth memo
2026-06-29
www.reuters.com
2026-06-29
Reuters
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