Semiconductor News & Analysis Feed
1387 articles
2026-06-15
evertiq.com
2026-06-15
Evertiq
© Liviorki for Evertiq
Business | June 15, 2026
CADFEM APAC, SilTerra partner to advance semiconductor innovation
Evertiq
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.
CADFEM APAC, a Hyderabad-ba
2026-06-15
www.igorslab.de
2026-06-15
igor´sLAB
LATEST NEWS
Qualcomm launches Snapdragon C: entry-level notebooks for around 300 US dollars with Arm chip and NPU
15. June 2026 06:00Samir Bashir
📖 Reading time: approx. 7 minutes · 1,224 words · 7,865 characters
To be honest, I had to look at the announcement twice at first: Qualcomm is bringing a chip for $300 laptops? At a time when DRAM prices are exploding and even entry-level notebooks are
2026-06-15
www.megabites.com.ph
2026-06-15
megabites.com.ph
Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for rea
2026-06-15
news.google.com
2026-06-15
EE Times India
2026-06-15
www.businesskorea.co.kr
2026-06-15
Businesskorea
AI Demand Drives Memory Chips To More Than 80% Growth
Samsung Electronics and SK hynix. (Photo courtesy of techovedas.com)
The global semiconductor market is experiencing an unprecedented boom, driven by the explosive growth of the artificial intelligence (AI) industry. In particular, the memory semiconductor sector is leading overall market growth, raising expectations for improved earnings amon
2026-06-15
news.google.com
2026-06-15
EE Times Asia
2026-06-15
news.google.com
2026-06-15
EE Times Asia
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
www.thefastmode.com
2026-06-15
The Fast Mode
KKR, together with the Kuwait Investment Authority (KIA), NVIDIA and Vistra announced the launch of Helix Digital Infrastructure (Helix), a new company designed to deliver integrated infrastructure at the speed and scale required for hyperscalers to meet accelerating artificial intelligence (AI) demand.
As building AI infrastructure becomes increasingly complex, Helix will serve as a single coor
2026-06-15
digitimes.com
2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
digitimes.com
2026-06-15
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure beneficiaries and legacy consumer electronics players. The five-month cumulative picture through May underscores a structural reordering of the sector's top earners, led by server and AI hardware demand.
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive electronics, and future device upgrades lifts orders while memory shortages weigh on shipments across the broader electronics supply chain.
2026-06-15
digitimes.com
2026-06-15
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
2026-06-15
digitimes.com
2026-06-15
INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year, citing a supply-demand imbalance in the memory market and sharp raw material price increases. The company said it expected a gradual recovery in the second half of 2026 as industry inventories normalized and new products and customers began contributing. INPAQ also ou
2026-06-15
semiengineering.com
2026-06-15
Ed Sperling
Chip and system designers scramble to leverage existing and future standards as edge AI...
2026-06-15
digitimes.com
2026-06-15
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lappi
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization