Semiconductor News & Analysis Feed
482 articles
2026-05-12
www.electronicsforyou.biz
2026-05-12
Electronics For You BUSINESS
__fail__
2026-05-11
www.electronicsweekly.com
2026-05-11
Electronics Weekly
__fail__
2026-05-11
www.newelectronics.co.uk
2026-05-11
New Electronics
Several customers are said to have approached the South Korean chipmaker with proposals that include direct investment in new manufacturing capacity and financial support for equipment purchases.These offers are certainly unusual in the memory sector, where chipmakers have traditionally funded their own expansion rather than relying on customer backing.The proposals reportedly include funding for
2026-05-11
www.electronicsforyou.biz
2026-05-11
Electronics For You BUSINESS
__fail__
2026-05-11
pulse.mk.co.kr
2026-05-11
매일경제
__fail__
2026-05-11
www.chosun.com
2026-05-11
조선일보
__empty__
2026-05-08
www.electronicsforyou.biz
2026-05-08
Electronics For You BUSINESS
__fail__
2026-05-07
www.openpr.com
2026-05-07
openPR.com
__fail__
2026-05-07
koreajoongangdaily.joins.com
2026-05-07
Korea JoongAng Daily
__fail__
2026-05-06
www.msn.com
2026-05-06
MSN
__fail__
2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
Organised by the School of Electrical and Electronic Engineering and supported by semiconductor firm EnSilica and a number of industry sponsors, the initiative used the Tiny Tapeout framework to deliver practical ASIC design experience. The approach, which uses a multi-project wafer (MPW) model, enables multiple designs to be manufactured together at reduced cost.According to organisers, the event
2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up
2026-05-06
www.idtechex.com
2026-05-06
IDTechEx
Home技術議題研究摘要Why Consumer Electronics Will Continue to Lead the Edge AI Chip MarketWhy Consumer Electronics Will Continue to Lead the Edge AI Chip Market2026年2月25天Latency, energy, privacy. By shifting AI computation from the cloud to the edge, these issues can be alleviated. 2025 was a breakout year for many AI applications, with consumer electronics leading the way in revenue due to the trend towa
2026-05-05
news.google.com
2026-05-05
Benzinga
2026-05-05
www.prnewswire.com
2026-05-05
PR Newswire
2026-05-05
koreajoongangdaily.joins.com
2026-05-05
Korea JoongAng Daily
2026-05-04
news.samsung.com
2026-05-04
samsung.com
2026-05-04
www.thelec.net
2026-05-04
thelec.net
2026-05-04
www.digitimes.com
2026-05-04
digitimes
2026-04-29
eetimes.com
2026-04-29
Yashasvini Razdan
Introducing STM32C5 in India, STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance, memory, and connectivity.