Semiconductor News & Analysis Feed

In July 2026, Mouser Electronics, a leading global distributor of electronic components, launched the new PSOC™ Edge E84 AI evaluation kit from Infineon Technologies. Designed for rapid prototyping of wearables, smart home devices, and AI-powered applications, the kit supports embedded systems devel

In 2026, Infineon Technologies AG received multiple accolades for its investor relations (IR) efforts at the German Investor Relations Award presented by DIRK. The company was jointly awarded first place among DAX 40 companies for 'Best Investor Relations', alongside Siemens Energy AG. Infineon also

Nexperia and Semikron Danfoss have signed a Memorandum of Understanding (MoU) to explore strategic collaboration on silicon carbide (SiC)-based power modules for automotive traction inverter applications. The partnership combines Nexperia’s expertise in SiC semiconductor technology with Semikron Dan

ROHM has introduced the TSC3PAK SiC MOSFET package in June 2026, aimed at enhancing efficiency and reliability in power conversion circuits for electric vehicles. The new package features a top-side heat dissipation structure that matches the thermal performance of conventional through-hole packages

Texas Instruments (TI) has introduced the BQ79826Z-Q1, a high-channel-count battery monitor with integrated electrochemical impedance spectroscopy (EIS) technology, aimed at enhancing safety and performance in electric vehicles (EVs) and energy storage systems (ESS). This new chip supports up to 26

Navitas has introduced a new isolated through-hole package, the UHV-TO-247-4-ISO, tailored for 1200V to 3300V GeneSiC silicon carbide MOSFETs. This package delivers module-level performance in a compact discrete form factor, featuring over 6000V integrated isolation and direct-cooled thermal managem