Semiconductor News & Analysis Feed
141 articles
2026-06-18
digitimes.com
2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-17
digitimes.com
2026-06-17
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data center deployments on another. However, during PCIM Europe 2026 in Nuremberg, Germany, industry leaders and experts discussed and dismantled thi
2026-06-16
tomshardware.com
2026-06-16
Hassam Nasir
Intel's cancelled "Arctic Sound" AI GPU based on the original Xe-HP architecture has been pictured sporting two tiles and 32GB of HBM2E.
2026-06-16
www.uidaho.edu
2026-06-16
University of Idaho
BY CHRIS COOK, U OF I EXECUTIVE DIRECTOR OF ADMISSIONS AND RECRUITMENT & FENG LI, MICRON ENDOWED PROFESSOR IN MICROELECTRONICS AND NGEM DIRECTOR
Semiconductors are no longer a niche corner of the tech economy. They are essential infrastructure. Microchips made from semiconductor materials power artificial intelligence, national defense systems, advanced manufacturing, transportation networks, ene
2026-06-15
www.engineering.com
2026-06-15
Engineering.com
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2026-06-15
www.engineering.com
2026-06-15
Engineering.com
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2026-06-15
www.engineering.com
2026-06-15
Engineering.com
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2026-06-15
semiengineering.com
2026-06-15
Semiconductor Engineering
Researchers from Politecnico di Torino and CEA-List published a technical paper titled “InjectV: Modeling Fault Injection Attacks in RISC-V Simulation Environment.”
“Fault Injection Attacks (FIAs) are a significant threat to hardware security, capable of compromising systems by inducing malicious faults in computation or storage. Evaluating resilience against such attacks is challenging due to th
2026-06-13
phys.org
2026-06-13
Phys.org
__fail__
2026-06-13
interestingengineering.com
2026-06-13
Interesting Engineering
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2026-06-12
www.engineering.com
2026-06-12
Engineering.com
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2026-06-12
semiengineering.com
2026-06-12
Semiconductor Engineering
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2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
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CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 9:00 PM PDT 3 min read
HYDERABAD, India and SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure
2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
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CADFEM APAC and SilTerra Malaysia Partner to Advance Semiconductor Innovation Through Simulation-Driven Engineering
PR Newswire
Thu, June 11, 2026 at 6:30 PM PDT 2 min read
SEBERANG PERAI, Malaysia, June 12, 2026 /PRNewswire/ -- The semiconductor industry is under growing pressure to deliver more capa
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
news.google.com
2026-06-12
Semiconductor Engineering
2026-06-11
www.enr.com
2026-06-11
Engineering News-Record (ENR)
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2026-06-11
news.google.com
2026-06-11
The Futurum Group
2026-06-11
www.engineering.com
2026-06-11
Engineering.com
www.engineering.com
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2026-06-11
semiengineering.com
2026-06-11
Semiconductor Engineering
Energy-efficient SoC design, optimizing PPA, deep low-voltage operation, and advanced power management techniques.
Access “Foundation IP: Pushing the Boundaries of Energy-Efficient Chip Design” to explore six articles that explain how to address SoC design challenges using advanced Foundation IP solutions. Learn how these approaches enable energy efficiency, high performance, and reliability acro