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Silicon Box, a Singapore-based advanced semiconductor panel-level packaging and chiplet integration firm, has on Monday announced that it has secured S$100 million ($77.65 million) in debt financing from leading institutional investors – funds managed by Ares Management Corporation (Ares), InnoVen Capital, January Capital Growth Credit (January Capital), and Abound Capital.
The facility includes
2026-06-09
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2026-06-09
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2026-06-09
AMD said on June 8 it plans to invest up to GBP2 billion (approx. US$2.67 billion) in the UK over the next five years to accelerate AI innovation and research and broaden access to advanced computing resources. The company said the funding is intended to support long-term economic growth and scientific leadership nationwide.
2026-06-09
digitimes.com
2026-06-09
ELAN Microelectronics is broadening beyond notebook PCs into agentic AI PCs, unmanned vehicles, and optical communication chips, moves that could influence technology supply chains across Asia, the US, and Europe. The company also disclosed a strategic investment in US-based PETA Optronics, signaling a deeper push into next-generation hardware markets worldwide.
2026-06-09
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2026-06-09
Nvidia and Hyundai Motor Group have agreed to deepen their collaboration in artificial intelligence, robotics, and future mobility technologies as the two companies seek to accelerate the commercialization of physical AI and expand South Korea's role in next-generation AI infrastructure.
2026-06-09
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2026-06-09
TSMC's AI capacity crunch is giving Intel its clearest opening in years to re-enter the most advanced chipmaking race, with Google and Nvidia exploring Intel as a potential backup manufacturing and packaging partner for next-generation AI processors.
2026-06-09
digitimes.com
2026-06-09
Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun
2026-06-09
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Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
Cadence Announces Collaboration With Intel Foundry To Accelerate Intel 14A Process Optimization For Hpc And Mobile Designs
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2026-06-09
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2026-06-09
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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
2 hrs ago
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Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies
2026-06-09
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2026-06-09
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2026-06-09
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2026-06-09
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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
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2026-06-09
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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
Business Wire
Mon 8 June 2026 at 1:15 pm GMT-7 2 min read
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Expanded cooperation spans DTCO, IP readiness and design enablement to advance next-generation c
2026-06-09
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2026-06-09
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SEOUL, June 8 (Reuters) – Samsung Electronics’ co-CEO and head of its chip division, Jun Young-hyun, said on Monday he discussed cooperation in next-generation foundry chips with Nvidia CEO Jensen Huang during a meeting in Seoul.
Jun said Samsung and Nvidia are currently collaborating on autonomous driving chips and Groq AI accelerator chips, and also discussed cooperation on future gener
2026-06-09
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2026-06-08
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2026-06-08
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2026-06-08
The Joplin Globe
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