Semiconductor News & Analysis Feed
20 articles
2026-10-06
2026-09-16
2026-09-15
www.digitimes.com
2026-09-15
2026-09-15
www.digitimes.com
2026-09-15
Samsung Electronics is accelerating semiconductor packaging restructuring by reallocating capacity from Exynos to HBM products at its Cheonan facility. This strategic reallocation reflects Samsung's response to evolving market dynamics and competitive pressures in the semiconductor industry. HBM mem
2026-09-11
2026-09-10
news.google.com
2026-09-10
2026-09-10
news.google.com
2026-09-10
2026-09-03
www.sammobile.com
2026-09-03
2026-09-02
nokiamob.net
2026-09-02
The leaked specifications for the upcoming Samsung Galaxy S27 Ultra indicate that the company is planning to reintroduce its in-house Exynos processor, specifically the Exynos 2700 chip built on a 2nm process. After a disappointing performance by the Exynos 2200 in the Galaxy S22 Ultra, Samsung had
2026-07-22
2026-07-21
2026-07-21
2026-07-09
2026-06-24
www.digitimes.com
2026-06-24
Samsung Electronics is pushing its mobile business to expand the adoption of its in-house Exynos 2700 processor beyond standard Galaxy S27 and S27 Plus models into premium devices like the Galaxy S27 Ultra and Galaxy Z Fold 8. This strategic move demonstrates Samsung's commitment to advancing chip t
2026-06-24
2026-06-22
www.androidheadlines.com
2026-06-22
Samsung Electronics faces challenges in 2nm chip manufacturing, with its Exynos chips potentially lagging behind TSMC's advanced processes. However, Samsung has formulated an应对 plan. This situation reflects the intense competition in the global semiconductor industry, particularly in advanced proces
2026-06-21
wccftech.com
2026-06-21
Despite Samsung's advancements in advanced lithography, the upcoming Exynos 2700 faces competitive pressure from TSMC's 2nm N2P process. Although Samsung's 2nm GAA process is progressing, rumors suggest it lags behind TSMC’s in terms of Power, Performance, and Area (PPA) metrics. To compensate, Sams
2026-06-20
www.phonearena.com
2026-06-20
According to PhoneArena, the performance of Samsung's Galaxy S27 Ultra may not meet expectations due to Qualcomm's ineffective use of Exynos features. This development highlights the intense competition in the mobile processor market and the varying capabilities of different chip manufacturers in te
2026-06-19
wccftech.com
2026-06-19
Qualcomm is copying Samsung's Exynos 2600's innovative Heat Path Block (HPB) thermal technology for its upcoming Snapdragon 8 Elite Gen 6 Pro, though with subpar implementation. This move highlights the intense competition in semiconductor thermal management, where Samsung's recent breakthrough has
2026-06-18
wccftech.com
2026-06-18
Samsung has demonstrated its capability to leverage advanced nodes for developing and mass-producing cutting-edge chipsets, with the Exynos 2700 reportedly progressing on schedule without setbacks. However, while the company's second-generation 2nm GAA SoC shows promise, its overall SoC division is