Semiconductor News & Analysis Feed

Hanmi Semiconductor's delivery of its first FC Bonder 75 to a global customer marks a pivotal strategic inflection point for the South Korean equipment maker. Historically anchored in the HBM TC bonder niche, Hanmi has now crossed into the broader AI back-end packaging equipment space, signaling a d

Hanmi Semiconductor's launch of the FC Bonder 3.5 represents a strategic expansion into advanced packaging, targeting the growing AI chip market. This move demonstrates the company's shift beyond traditional thermal compression bonding equipment toward more sophisticated packaging solutions. The adv

HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst