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Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time th

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.

By  Jeong Du-yong Published 2026.06.26. 10:39 Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor## HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th