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Trending Technologies
EUV15 3nm14 HBM3 AI accelerators3 GPU2 AI infrastructure2 3D V-Cache2 LLM2 EUV lithography2 DUV lithography2 photolithography systems2 CSI-21
2026-08-24
Arm Dissects Its AGI CPU Which Is Tailor-Made For AI: Dual Chiplets With >100B Transistors, 136 Neoverse V3 Cores, Driving A $2B Demand In 2027-2028 - Wccftech
0.95
news.google.com 2026-08-24
2026-08-24
IBM Details The World’s First Dual-Architecture Processor As It Builds Its Next-Gen Dual ISA Core That Natively Executes Z & Arm Software On The Same Chip - Wccftech
0.95
wccftech.com 2026-08-24
2026-08-24
Xiaomi’s XRING 03 Goes Official On TSMC’s 3nm N3P Process, Sports 24 Billion Transistors, First Smartphone SoC To Support LPDDR6 RAM, All-Big-Core CPU Design & More - Wccftech
0.92
wccftech.com 2026-08-24
2026-08-24
NVIDIA’s Vera Rubin & Blackwell GPU Server Prices Could Soar By As Much As 17% As Memory Prices Bite, Say Reports - Wccftech
0.9
wccftech.com 2026-08-24
2026-08-24
d-Matrix’s Raptor 3D DRAM Achieves SRAM-Class Bandwidth at 1/10th the HBM Power by Dropping PHY & Fusing DRAM Beneath the Compute - Wccftech
0.95
wccftech.com 2026-08-24
2026-08-24
SK Hynix Unpacks Advanced Packaging Technologies, Including Intel EMIB, For Its Next-Gen HBM Memory As It Eyes 3D Structures For The Future - Wccftech
0.95
wccftech.com 2026-08-24
2026-08-24
Samsung Leverages Advanced Logic Processes To Advance HBM As It Works On Its Next-Gen zHBM DRAM That 3D Stacks Memory On Compute - Wccftech
0.95
wccftech.com 2026-08-24
2026-08-24
Micron Says AI’s Memory Wall is Worsening as Compute outruns HBM Bandwidth by 3x every Two Years, Advanced Packaging & Process To Tackle Rising Thermal Constraints - Wccftech
0.95
wccftech.com 2026-08-24
2026-08-22
NVIDIA Wants To Turn Your Home Wall Into A Mini Data Center By Packing 16 Blackwell GPUs And 4 server CPUs In A Liquid-Cooled, Wall-Mounted Box At $0 Upfront Cost - Wccftech
0.95
wccftech.com 2026-08-22
2026-08-20
SK hynix Showers Workers With HBM Windfall: Bereavement Benefits Extend To Aunts And Uncles, Downside Protection For Stock Awards, And Revamped $144,000 Housing Loan Limits - Wccftech
0.95
wccftech.com 2026-08-20
2026-08-20
Intel’s Razor Lake Will Reportedly Tap TSMC’s 2nm N2X Process, Squeezing AMD Out of Already-Constrained Fab Capacity - Wccftech
0.95
wccftech.com 2026-08-20
2026-08-19
Morgan Stanley Raises Alarm Bells: DDR4 Prices Will Jump By 50% In Q3, As Memory Makers Starve Legacy DRAM To Feed HBM - Wccftech
0.87
news.google.com 2026-08-19
2026-08-19
Alibaba’s TSMC-Built 5nm RISC-V Chip, XuanTie C950, Now Runs Qwen-3.8 27B Model Natively, Unlocking Massive Vertical Integration Tailwinds - Wccftech
0.95
news.google.com 2026-08-19
2026-08-16
US Tech Advisor David Sacks Calls The Biggest Risk To NVIDIA’s $500 Billion AI Financing Plan A ‘Dark GPU’ Glut - Wccftech
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wccftech.com 2026-08-16
US technology advisor David Sacks has raised concerns about the biggest risk to NVIDIA's $500 billion AI financing plan, identifying an oversupply of computing capacity as the primary threat. Following NVIDIA's announcement that GPUs are now being treated as a financial asset class, Sacks highlighte
NVIDIAArtificial IntelligenceGPUSemiconductorAI ComputingTechnology InvestmentAI InfrastructureChip Supply
2026-08-15
SanDisk Takes ‘Finance Bros’ For A Ride: Cherry-Picks BF16 Quantization And Outdated HBM Specs, While Completely Glossing Over HBF’s Write Endurance Issues - Wccftech
0.8
news.google.com 2026-08-15
2026-08-14
Samsung May Push HBM Base Dies to Cutting-Edge 2nm, Extending Its Own 4nm HBM4 Roadmap - Wccftech
0.85
news.google.com 2026-08-14
2026-08-14
HBM’s Manufacturing Complexities Mean General-Purpose DRAM Still The Primary Cash Cow For Companies Like Micron; Gross Margins Estimated To Reach 95% In 2027 - Wccftech
0.75
wccftech.com 2026-08-14
While HBM continues to gain importance in datacenters and GPUs for AI inference due to its capacity and bandwidth advantages, recent research reveals that memory manufacturers like Micron are still benefiting more from general-purpose DRAM shipments in terms of gross margins. The latest findings ind
HBMDRAMMicronDatacenterGPUAISemiconductor ManufacturingGross Margin
2026-08-13
Tensor G6 May Be Manufactured On An Older Node, Not TSMC’s 2nm Process; Google Offers No Confirmation Apart From Percentage Improvements [3nm Confirmed] - Wccftech
0.85
news.google.com 2026-08-13
2026-08-13
Qualcomm Aims Snapdragon C At $300 Laptops With Up To 16 GB Memory, Claims 67% Faster Speeds And 2x Efficiency Over Intel’s Twin Lake - Wccftech
0.85
wccftech.com 2026-08-13
Qualcomm unveiled its entry-tier Snapdragon C series SoCs at Computex 2026, targeting budget laptops priced around $300. These chips are built on ARM architecture with up to 16GB memory support and deliver significant performance and efficiency gains over Intel’s Twin Lake N250 platform. Benchmarks
QualcommSnapdragon CSoCPC chipperformanceefficiencyentry-level laptopIntel
2026-08-13
TSMC Exec Makes Big Announcement & Confirms 98% Yield For CoWoS Packaged AI Chips - Wccftech
0.92
wccftech.com 2026-08-13