84 articles
2026-05-16
focustaiwan.tw 2026-05-16 Focus Taiwan
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2026-05-15
www.azom.com 2026-05-15 AZoM
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2026-05-14
digitimes.com 2026-05-14
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen Tien detailed the company's latest progress in advanced process nodes, 3DFabric advanced packaging, global expansion, and AI-powered smart man
2026-05-14
www.newelectronics.co.uk 2026-05-14 New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
2026-05-14
www.bizjournals.com 2026-05-14 The Business Journals
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2026-05-13
www.eejournal.com 2026-05-13 EEJournal
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2026-05-13
blogs.nvidia.com 2026-05-13 NVIDIA Blog
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2026-05-13
digitimes.com 2026-05-13
TSMC's board of directors approved a US$31.3 billion capital budget on May 12 for advanced-process capacity buildout, factory construction, and fab infrastructure — and separately approved a capital injection of up to US$20 billion into its wholly owned US subsidiary, TSMC Arizona.
2026-05-13
digitimes.com 2026-05-13
China's top foundry SMIC is entering a new growth phase after regulators approved a record CNY40.6 billion (US$5.98 billion) asset acquisition that strengthens its grip over one of its most profitable wafer fabs, while surging domestic AI infrastructure spending is rapidly reshaping the company's long-term outlook.
2026-05-13
digitimes.com 2026-05-13
Of the 238 Taiwan-listed semiconductor and related companies tracked by Digitimes,73% (173 companies)posted positive year-on-year revenue growth in April 2026, and58% (139)grew month-over-month. Memory makers, AI server assemblers, and advanced packaging houses led the advance, while silicon wafer suppliers and a handful of fabless names faced ongoing headwinds.
2026-05-13
digitimes.com 2026-05-13
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn
2026-05-13
www.techpowerup.com 2026-05-13 TechPowerUp
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2026-05-12
tomshardware.com 2026-05-12 Anton Shilov
Despite challenges, TSMC is optimistic about Fab 21.
2026-05-12
seekingalpha.com 2026-05-12 Seeking Alpha
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2026-05-12
www.msn.com 2026-05-12 MSN
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2026-05-12
digitimes.com 2026-05-12
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider limited shifts in manufacturing partners to ease constraints.
2026-05-12
digitimes.com 2026-05-12
Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's accelerated expansion of 2nm process and advanced packaging capacity, and ongoing fab construction projects across the semiconductor, high-tech, and memory industries.
2026-05-11
www.electronicsweekly.com 2026-05-11 Electronics Weekly
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2026-05-11
wccftech.com 2026-05-11 Wccftech
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2026-05-11
digitimes.com 2026-05-11
Global memory supply is under severe strain, prompting major cloud service providers to sign multi-year contracts with memory makers and forcing the industry to rethink capacity spending and pricing. The shortage reflects long lead times for new fabs and a strategic shift toward higher-margin memory types.