Semiconductor News & Analysis Feed

Samsung Electronics is trying to turn its foundry business into a bigger supplier of custom chips, with Meta Platforms and Anthropic reportedly considering Samsung for processors after its Tesla win, according to Seoul Economic Daily. The potential orders could push Samsung Foundry toward profitability sooner than expected, with industry sources estimating its medium- to long-term order backlog co

As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations at the Taylor plant and landing major orders.

Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO Lip-Bu Tan to reorganize the company's foundry business.

Samsung Electronics' foundry business has signed a strategic manufacturing collaboration with Claros, a US power-management startup, to produce semiconductors designed to cut energy waste inside AI data centers, according to a Claros announcement and a report by ZDNet Korea.

Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO. Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, syste

Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.

Samsung Electronics' foundry business may return to profit as early as the third quarter of 2026, ahead of its previous target of late 2026 to 2027, as improving yields, larger orders, and stronger demand for high-bandwidth memory base dies lift utilization, according to Korean media reports.

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.