Semiconductor News & Analysis Feed

Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.

Samsung Electronics signaled that discussions on cooperation with Nvidia are progressing smoothly, and that collaboration in next-generation memory and foundry services will continue to expand. The comment was made by Samsung Electronics co-CEO and head of the Device Solutions (DS) division Young-hyun Jun following talks with Nvidia CEO Jensen Huang and senior executives at The Shilla hotel in Jun