Semiconductor News & Analysis Feed
5531 articles
2026-06-12
www.bitget.com
2026-06-12
Bitget
On June 12, Infineon Technologies AG announced that it is preparing to launch its largest single investment to date—a semiconductor factory costing €5 billion (approximately 39.2 billion RMB). The construction of this factory has received subsidies from the European Union, aimed at increasing chip production. Infineon's Chief Operating Officer Alexander Gorski stated on-site this week that this po
2026-06-12
simplywall.st
2026-06-12
simplywall.st
United States/Semiconductors/NasdaqGM:NVTS
Navitas Semiconductor (NVTS) Stock Valuation After New SiC Package And NVIDIA AI Data Center Role
June 12, 2026
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Navitas Semiconductor (NVTS) has drawn fresh attention after unveiling a new ultra high voltage UHV-TO-247-4-ISO package for its GeneSiC SiC MOSFETs, alongside a high profile role in NVIDIA’s AI data center ecosys
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
digitimes.com
2026-06-12
Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly receiving a purchase order for high-pressure hydrogen annealing equipment.
2026-06-12
digitimes.com
2026-06-12
Broadcom has acknowledged it will not win all of Google's TPU orders, highlighting how tensor processing units have become a competitive arena for multiple chipmakers. For global readers, the shift signals a broader race for cloud AI supply, capacity, and influence, as more firms vie for a share of high-value custom chip demand.
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
DDR4 memory supply remains tight, with the shortage affecting buyers worldwide, from cloud and server operators to industrial and networking customers. Sources indicate that Nanya Technology's limited third-quarter 2026 capacity has led major shareholders and customers to secure output, pushing contract prices higher and making further gains increasingly likely.
2026-06-12
digitimes.com
2026-06-12
ChangXin Memory Technologies (CXMT), China's largest DRAM maker, plans to raise approximately CNY29.5 billion (US$4.35 billion) through an IPO on Shanghai's STAR Market, fueling debate about whether China's push into memory semiconductors can eventually erode the dominance of the industry's established players.
2026-06-12
digitimes.com
2026-06-12
Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked. For global readers, the deal signals how semiconductor suppliers are positioning themselves around next-generation supply chains, customer demand, and the expansion of AI-driven industrial ecosystems.
2026-06-12
digitimes.com
2026-06-12
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans memory modules, controller chips, and niche DRAM, underscoring how China's memory industry is evolving from upstream chipmakers into a broader supply chain ecosystem.
2026-06-12
digitimes.com
2026-06-12
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed that the US government could block imports to the US of chips made by TSMC as a result of the case, and have enlisted several members of Congress to support their position, drawing market attention.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
digitimes.com
2026-06-12
Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.
2026-06-12
digitimes.com
2026-06-12
SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead with a broader capacity buildout and moving toward a US listing as early as August.
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com
2026-06-12
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply chain as demand for advanced AI silicon strains capacity at TSMC.