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As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.

Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board

Build high-performance generative AI systems with Strands Agents, NVIDIA NIM, and Amazon Bedrock AgentCore by Kanishk Mahajan and Akshay Parkhi on 26 MAY 2026 in Amazon Bedrock Agents, Best Practices, Strands Agents, Technical How-to, Thought Leadership Permalink Comments Share Building high-performance generative AI agents requires architecture that can deliver fast inference, coordinate multi

Ubisoft is using an early build of its unannounced Far Cry 7 as a testbed for generative AI tools, according to Tom Henderson of Insider Gaming.

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