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To create a seamless experience and for website quality and improvement purposes, we use cookie technologies for verification and quality purposes, to personalize the content presented, and to provide advertising that may be of specific interest to you. Learn our Privacy Policy here. 智通财经APP获悉，光大证券发布研报称，玻璃基板凭借其优异特性，逐步成为新一代先进封装介质。当前TGV玻璃基板正处于从实验室基础研究向量产工程化跨越的历史性节点，且呈国外进度领先、国内加速追赶态势。建议紧盯下游客户验证与量产线建

[News] Glass Substrates Eye 2027 Launch, Scale Toward 2030 as CoWoS Costs Rise and Hyperscaler Demand Grows 2026-06-05 Semiconductors editor News Please note that this article cites information from Sisa Journal, Economic Daily News, Commercial Times, Forbes and The Elec. As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate so

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing power and energy efficiency. The concept is increasingly seen as a key route... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each tim

Two separate announcements on May 29 landed in the same corner of the semiconductor industry, and their combined implications for South Korea's chipmakers are more significant than either story suggests on its own. Nikon's new chief executive told Nikkei Asia that the Japanese optics maker is in advanced talks with major chipmakers in the United States and Asia to supply lower-priced deep-ultravio

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's... Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they v

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.