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The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.

Micron breaks ground on Hiroshima expansion to boost AI memory chip production

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digitimes.com 2026-07-06

Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.

Micron Invests $9.3 Billion to Expand Hiroshima HBM Plant in Japan, Shipments Expected by 2028 - finance.biggo.com

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news.google.com 2026-07-05 finance.biggo.com

HBM competition heats up! Micron breaks ground on $9 billion expansion project in Japan, with shipments expected in 2028 - 富途牛牛

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news.google.com 2026-07-05 富途牛牛

Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up - digitimes

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www.digitimes.com 2026-07-05 digitimes

Component inflation weighs on manufacturing momentum as Taiwan PMI growth moderates

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digitimes.com 2026-07-05

Surging demand for high-bandwidth memory (HBM) used in AI servers has driven shortages and sharp price increases for conventional memory, while microcontroller (MCU) suppliers have also begun passing higher costs on to customers. Apple raised prices for certain Mac and iPad models in late June, and market rumors suggest the upcoming iPhone 18 could see price increases of as much as 30%.

Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up

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digitimes.com 2026-07-05

Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me

Micron breaks ground on $9.3 billion expansion project in Hiroshima, with HBM shipments expected in the second half of 2028. - Moomoo

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news.google.com 2026-07-05 Moomoo

Micron (MU) Starts Major Japan Expansion to Boost HBM Output for the AI Boom - TipRanks

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news.google.com 2026-07-05 TipRanks

Micron Expands Hiroshima Plant for Next-Gen HBM - 조선일보

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www.chosun.com 2026-07-04 조선일보

Micron builds Japan HBM plant, targets 2028 shipments amid AI boom - CHOSUNBIZ - Chosunbiz

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biz.chosun.com 2026-07-04 Chosunbiz