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This will let Google show Yonhap news articles that match or are related to your search SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell

INFRASTRUCTURE hbm packaging semiconductor investment south korea semiconductors Samsung and SK hynix Build HBM Packaging Fabs 15 sources | July 2, 2026 | By LDS Team 7.4 Relevance Score Photo: newsimg.koreatimes.co.kr · rights & takedowns QUICK SUMMARY Hide Samsung Electronics and SK hynix will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a

This undated file photo shows SK hynix Inc.'s factory in Cheongju, 113 kilometers south of Seoul. (SK hynix Inc.) An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intelligence-l

An artist's rendering of SK hynix's P&T7 packaging fab in Cheongju, North Chungcheong Province / Courtesy of SK hynix An industrywide 392 trillion-won ($252.5 bil.) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics and SK hynix, as part of the government's drive to spread artificial intelligenc

This will let Google show Yonhap news articles that match or are related to your search SEOUL, July 2 (Yonhap) -- An industrywide 392 trillion-won (US$252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM) fabs and packaging facilities by Samsung Electronics Co. and SK hynix, as part of the government's drive to spread artificial intell

Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC) Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets. The company recently completed development of next-generation p

Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic

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