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Genesem says orders for HBM and advanced packaging equipment are becoming increasingly visible as the market expands. (Photo: THE ELEC) Genesem said on Monday that orders for advanced packaging equipment are becoming increasingly visible as demand rises in the high-bandwidth memory (HBM) and advanced semiconductor packaging markets. The company recently completed development of next-generation p

Optical communication stocks surged on May 26 due to advancements in GPU-HBM integration using fiber optic interconnects. This innovative solution overcomes physical limitations of traditional 2.5D packaging by decoupling compute and memory units, allowing greater HBM capacity and improved thermal management. If successful, it will expand optical interconnects beyond data centers and benefit silic

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