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The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.

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While China develops workarounds to US sanctions of high-end extreme ultraviolet (EUV) machines, the shortage in the memory industry due to high demand from AI chips has created an opportunity for Chinese firms to gain market share, suggests a report from the Korean media. The aggressive approach, led by the Chinese government, has narrowed down the gap between China and Korea for HBM memory to th

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