Semiconductor News & Analysis Feed
3090 articles
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
NEWS PROVIDED BY
Rapidus Corporation
Jun 15, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries.
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
www.msn.com
2026-06-16
MSN
Record price target: TD Cowen lifted Micron's target to $1,500, projecting strong AI-fueled growth and sustained pricing power.
Supply sold out: Micron's 2026 high-bandwidth memory output is fully booked, with 2027 orders already under negotiation.
Earnings in focus: Investors await June 24 results for signs of long-term contracts and profit margin strength.
Record-breaking rally: Micron stock
2026-06-16
digitimes.com
2026-06-16
Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Informationreported, citing a person with direct knowledge of the deal. The two companies have discussed a price of US$8 billion to US$10 billion, the person said, a significant premium to Tenstorrent's last known valuation.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics' foundry business is reportedly expanding its strategic relationship with companies led by Elon Musk, with cooperation now spanning electric vehicles and emerging neurotechnology, according to Hankyungreporting.
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip Semiconductor delivered the key ranking shift, overtaking Taiwan's Vanguard International Semiconductor (VIS) for the first time to become the world's eighth-largest foundry.
2026-06-16
digitimes.com
2026-06-16
Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while losses, Tencent concentration, and a small share in Nvidia-led accelerators remain unresolved.
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
simplywall.st
2026-06-16
simplywall.st
Germany/Semiconductors/XTRA:AIXA
AIXTRON (XTRA:AIXA) Stock Valuation After ROHM GaN Partnership And Strong AI Power Demand
June 16, 2026
Simply Wall St
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ROHM Semiconductor’s decision to deploy AIXTRON (XTRA:AIXA) G10-GaN equipment for in-house gallium nitride epitaxy puts fresh attention on the stock, as investors weigh what this partnership could mean for growth-focused power elec
2026-06-16
stocktwits.com
2026-06-16
Stocktwits
stocktwits.com
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2026-06-16
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2026-06-16
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