Semiconductor News & Analysis Feed
2856 articles
2026-06-12
theedgemalaysia.com
2026-06-12
The Edge Malaysia
BERLIN (June 12): Infineon Technologies AG is preparing to open its largest single investment, a €5 billion (US$5.8 billion or RM23.43 billion) semiconductor factory built with the help of European Union subsidies, as the bloc seeks to boost chip production.
The power chip fab, which is an extension of the German company’s Dresden campus, will open on July 2, chief operating officer Alexander Go
2026-06-12
www.msn.com
2026-06-12
MSN
Infineon Technologies AG (IFNNY) is set to inaugurate its largest-ever standalone investment, a €5B ($5.8 billion) semiconductor manufacturing facility backed by European Union subsidies, as the bloc pushes to strengthen domestic chip production.
The power chip fab, which is an extension of the German company’s Dresden campus, will open on July 2, Chief Operating Officer Alexander Gorski said this
2026-06-12
news.google.com
2026-06-12
EE Times India
2026-06-12
news.google.com
2026-06-12
EE Times Asia
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply chain as demand for advanced AI silicon strains capacity at TSMC.
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2026-06-12
www.tweaktown.com
2026-06-12
TweakTown
Desktop GPU shipments hold steady in Q1 2026 with NVIDIA maintaining 90% market share
Q1 2026 GPU shipments dropped only 0.6%, far below the usual 12%, as NVIDIA holds 90% market share and Intel gains ground with Arc GPUs.
VIEW GALLERY - 3
Kosta Andreadis
Senior Editor
Published Jun 11, 2026 11:31 PM CDT
1 minute & 30 seconds read time
TL;DR: In Q1 2026, desktop GPU shipments slightly declined by
2026-06-12
startupfortune.com
2026-06-12
Startup Fortune
Infineon Technologies will open its Smart Power Fab in Dresden on July 2, putting a €5 billion European chip bet behind the power semiconductors AI data centers now need in volume.
The date matters because this is not another distant semiconductor promise. Infineon is bringing its Dresden Smart Power Fab forward from an autumn opening to July 2, 2026, after three years of construction and a deman
2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
www.bloomberg.com
2026-06-12
Bloomberg.com
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2026-06-12
www.tweaktown.com
2026-06-12
TweakTown
The current memory crisis means that one of the only real ways to ease the burden on the consumer market and meet the insatiable demand from the AI and data center sectors is for key players to ramp up production of existing and next-gen memory chips. As one of the biggest players in the space, SK hynix is looking to do just that and, in the process, triple its wafer production.2VIEW GALLERY - 2 I
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness...
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2026-06-12
www.reuters.com
2026-06-12
Reuters
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2026-06-12
www.businesstimes.com.sg
2026-06-12
The Business Times
Singapore announces new road map to improve standards and conformance capabilities, partnerships
Five memorandums of understanding between EnterpriseSG and its international and regional partners are formalised
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Elysia Tan
Published Fri, Jun 12, 2026 · 10:30 AM
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DPM Gan says the new road map aims to “build and deepen trust, so that assu
2026-06-12
pandaily.com
2026-06-12
Pandaily
categories.technology
China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment
Published:
June 12, 2026
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China Delivers 5 Million GaN RF Chips for 6G Networks in Breakthrough Commercial Deployment China has delivered five million gallium nitride (GaN) radio freque...
China Delivers 5
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
digitimes.com
2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-12
digitimes.com
2026-06-12
Taiwanese power management IC supplier Global Mixed-mode Technology (GMT) will follow peers in seeking price increases from customers as tight chip supply continues to reshape capacity allocation across the industry.
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly receiving a purchase order for high-pressure hydrogen annealing equipment.
2026-06-12
digitimes.com
2026-06-12
As CXMT and YMTC move toward initial public offerings, other players across China's memory supply chain are also advancing expansion, fundraising, and listing plans. The activity spans memory modules, controller chips, and niche DRAM, underscoring how China's memory industry is evolving from upstream chipmakers into a broader supply chain ecosystem.