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Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.

News / EQS / ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance 2 min read ROHM Co., Ltd./ Key word(s): Miscellaneous ROHM's SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance 08.06.2026 / 09:05 CET/CEST The issuer is solely responsible for the content of this announceme

ROHM’s SiC MOSFET Adopted in BBU for AI Servers as HVDC Architectures Advance Willich-Münchheide, Germany, June 03, 2026 – ROHM has announced that its 750 V SiC MOSFET has been adopted in a BBU (Battery Backup Unit) for AI server power supplies. With the rise of generative AI, AI server power systems are shifting to higher voltages and rapidly transitioning to HVDC (high-voltage direct current) a

The shift toward 800V high-voltage direct current (HVDC) power architectures in AI data centers is driving a surge in demand for power semiconductors, boosting shipments for Taiwanese lead frame suppliers SDI Corporation and Jih Lin Technology and raising expectations for double-digit revenue growth in 2026.

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