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Samsung to improve HBM heat dissipation with HPB before hybrid bonding - Sammy Fans

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news.google.com 2026-07-06

Exynos 2700’s Innovative Heat Dissipation Solutions Are Key To Compensate For Samsung’s Inferior 2nm Process, Rumor Pits TSMC’s N2P Node As Superior - Wccftech

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wccftech.com 2026-06-21

Despite Samsung's advancements in advanced lithography, the upcoming Exynos 2700 faces competitive pressure from TSMC's 2nm N2P process. Although Samsung's 2nm GAA process is progressing, rumors suggest it lags behind TSMC’s in terms of Power, Performance, and Area (PPA) metrics. To compensate, Sams

Samsung Exynos 2700 TSMC 2nm process heat dissipation chip performance mobile SoC semiconductor manufacturing

ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support - The Manila Times

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www.manilatimes.net 2026-06-10

ROHM has launched a new TSC3PAK package for SiC MOSFETs, featuring a top-side cooling design that enables automated mounting while matching the heat dissipation performance of conventional through-hole packages like TO-247-4L. This innovation is particularly significant for electric vehicle applicat

SiC MOSFET Power Devices Automotive Electronics Electric Vehicles Power Conversion Heat Dissipation Package Technology Automated Mounting

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