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2026-06-18
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain
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digitimes.com 2026-06-18
A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis showed the HiSilicon Kirin 9030 processor was made on SMIC's third-generation 7nm-class N+3 process with a local metal pitch narrower than that of Intel's 18A chip used in Panther Lake.
2026-06-16
Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab
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tomshardware.com 2026-06-16 Luke James
SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.
SMICHuaweiKirin 9030Semiconductor Process7nm NodeMetal PitchIntel 18AChip Teardown
2026-06-09
HiSilicon chip price hikes put China's AI compute supply chain back in focus
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digitimes.com 2026-06-09
Huawei's chip design arm HiSilicon Technologies has reportedly raised prices for some products, drawing market attention as China's semiconductor sector shows signs of recovery after a prolonged downturn.