Semiconductor News & Analysis Feed
40 articles
2026-07-06
digitimes.com
2026-07-06
The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest for market share among Samsung Electronics, SK Hynix, and Micron Technology.
2026-07-06
digitimes.com
2026-07-06
Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.
2026-07-06
digitimes.com
2026-07-06
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.
2026-07-05
digitimes.com
2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
digitimes.com
2026-07-05
Surging demand for high-bandwidth memory (HBM) used in AI servers has driven shortages and sharp price increases for conventional memory, while microcontroller (MCU) suppliers have also begun passing higher costs on to customers. Apple raised prices for certain Mac and iPad models in late June, and market rumors suggest the upcoming iPhone 18 could see price increases of as much as 30%.
2026-07-03
digitimes.com
2026-07-03
Samsung Electronics is moving closer to commercialising HBM4E, its seventh-generation high-bandwidth memory (HBM), after internal testing showed reliability yields above 70%, strengthening its bid to gain ground in the AI memory market.
2026-07-02
digitimes.com
2026-07-02
Memory suppliers are renegotiating high-bandwidth memory contracts, and PC brands say price increases may slow later this year. For global buyers, that relief could be short-lived, as supply-chain sources warn that shortages tied to artificial intelligence demand are likely to keep memory markets tight through 2027.
2026-07-01
digitimes.com
2026-07-01
SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and found
2026-06-30
digitimes.com
2026-06-30
Memory pricing pressure continues to intensify. Contract prices have already recorded substantial gains for two consecutive quarters in the first half of 2026. The pace of quarterly increases may now moderate as the pricing base climbs higher. Still, the memory industry remains firmly in a seller's market. Supply constraints have spread beyond high-bandwidth memory (HBM) and premium DRAM products
2026-06-30
digitimes.com
2026-06-30
Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.
2026-06-29
digitimes.com
2026-06-29
Samsung Electronics could overtake SK Hynix in the global high-bandwidth memory (HBM) market in 2027, driven by the competitive edge of HBM4, the sixth generation of HBM. Market watchers also expect Samsung to expand 1c DRAM production for HBM4 while raising the latter's prices in 2027 to boost both market share and profitability.
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-25
digitimes.com
2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.
2026-06-24
digitimes.com
2026-06-24
Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.
2026-06-23
digitimes.com
2026-06-23
SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over whether its safety management system has gaps. The incidents have drawn scrutiny because many occurred after the M15X fab began operation, as the company ramped up production to meet surging high-bandwidth memory (HBM) demand.
2026-06-22
digitimes.com
2026-06-22
SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's KOSPI exchange, a milestone that reflects how high-bandwidth memory (HBM) has redefined the value of Korea's semiconductor industry.
2026-06-19
digitimes.com
2026-06-19
SK Hynix is reported to have held a private meeting with U.S. Deputy Secretary of State Allison Hooker, with industry sources speculating the discussions covered high-bandwidth memory cooperation with major U.S. technology firms and potential semiconductor investment expansion.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on schedule.
2026-06-18
digitimes.com
2026-06-18
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry watchers said the move reflects a greater focus on practical creativity and execution in the AI era rather than formal academic credentials.
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
Micron Technology (MU) Skyrocketed on Explosive Demand For High-Bandwidth Memory
Soumya Eswaran
Tue, 16 June 2026 at 8:04 am GMT-7 3 min read
MU
-6.18%
Columbia Threadneedle Investments, an investment management company, released its first-quarter 2026 investor letter for the “Columbia Global Technology Growth Fund”. A copy of the letter is available to download here. In Q1 2026, the Fund’s insti