Semiconductor News & Analysis Feed
10956 articles
2026-07-10
finance.yahoo.com
2026-07-10
Yahoo Finance
2026-07-10
www.fool.com
2026-07-10
The Motley Fool
2026-07-10
memeburn.com
2026-07-10
Memeburn
2026-07-10
finance.biggo.com
2026-07-10
finance.biggo.com
2026-07-10
finance.yahoo.com
2026-07-10
Yahoo Finance
2026-07-10
digitimes.com
2026-07-10
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion expected to reach 14 gigawatts in 2027.
2026-07-10
digitimes.com
2026-07-10
High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
2026-07-10
digitimes.com
2026-07-10
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
2026-07-10
digitimes.com
2026-07-10
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
2026-07-10
digitimes.com
2026-07-10
Topco Scientific (TSC) posted June 2026 revenue of NT$7.51 billion (approx. US$233.49 million), an increase of NT$970 million from May and 32.9% from a year earlier, setting a new single-month record. Cumulative revenue for the first half of 2026 reached NT$39.32 billion, up 20.2% year-over-year and setting a record for the period.
2026-07-10
digitimes.com
2026-07-10
For most of its modern history, India's Northeast — the eight states anchored by Assam — has sat at the margins of the country's industrial economy. That is beginning to change, as a mix of federal industrial incentives, a flagship semiconductor packaging plant in Assam, and deepening ties with Japan give the region a modest but real foothold in India's electronics ambitions.
2026-07-10
digitimes.com
2026-07-10
Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's advantages in common packaging optics (CPO) amid market attention on Corning's Glass Bridge technology.
2026-07-10
digitimes.com
2026-07-10
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site, is fundamentally a bet on where the AI era's most contested commodity, memory, will be manufactured.
2026-07-10
digitimes.com
2026-07-10
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
2026-07-10
digitimes.com
2026-07-10
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
2026-07-10
digitimes.com
2026-07-10
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.
2026-07-10
digitimes.com
2026-07-10
Kioxia and SanDisk have begun shipping samples of 332-layer BiCS10 NAND, giving the Japanese memory maker a concrete technology milestone as CEO Hiroo Ota works to pull the company back toward the top of the NAND industry.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
digitimes.com
2026-07-10
Chunghwa Precision Test Tech president Scott Huang said on July 7 that the company's biggest challenge over the next five years will be capacity as artificial intelligence demand surges across the semiconductor supply chain. He also urged Taiwan to increase investment in quantum technology and nuclear fusion, saying both fields could shape the island's long-term industrial future.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.