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The Taiwan Semiconductor Manufacturing Company (TSMC) is expanding its supply chain for glass substrates as part of the first step of establishing a supply chain for the chip-on-panel-on-substrate (CoPoS) packaging technology, according to supply chain sources. The glass substrates will be used in the firm's advanced versions of the chip-on-wafer-on-substrate (CoWoS) packaging technology, and TSMC

The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.

Zhen Ding Technology Group reported that May consolidated revenue reached a 2026 high as robust demand for high-end AI products drove significant year-over-year growth, the company said. The firm attributed the performance to a sharp uptick in server and optical module shipments, which rose nearly 2.5 times year-over-year, and strong momentum in IC substrate sales, which grew nearly 80% year-over-

消息面上，随着英伟达等AI芯片功耗飙升，传统硅基电源架构已触及物理极限。行业正加速向800V高压直流(HVDC)架构过渡，碳化硅成为AI服务器固态变压器及电源管理的必选材料。英飞凌、意法半导体等巨头明确表示，AI数据中心的部署导致多款功率器件出现严重供应短缺。 公开资料显示，天岳先进在8英寸碳化硅衬底领域占据全球领先份额，12英寸完成样品研发、送样、小批量试样供货。据悉，天岳先进的12英寸SiC衬底进入台积电供应链验证阶段，作为下一代CoWoS中介层备选方案开展送样测试。用作替代硅中介层以解决高性能GPU的散热瓶颈。 Tianyue Advanced Materials (02631.HK) rose nearly 7% in early trading. As of the time of writing, it was up 3.27% at HK$104.1, with a tr

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Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s

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