Semiconductor News & Analysis Feed
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2026-06-15
simplywall.st
2026-06-15
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Japan/Semiconductors/TSE:6963
Is ROHM (TSE:6963) Quietly Recasting Its Power-Semiconductor Edge Through Targeted SiC Design Wins?
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
ROHM recently introduced its TSC3PAK surface-mount package for SiC MOSFETs for xEV onboard chargers, electric compressors and industrial power systems, while its 750 V SiC MOSFETs were adopted in battery backup un
2026-06-15
www.morningstar.com
2026-06-15
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Provided by PR Newswire Jun 15, 2026, 9:00:00 AM
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconducto
2026-06-15
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2026-06-15
StreetInsider
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2026-06-15
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2026-06-15
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
PR Newswire
Sun, 14 June 2026 at 6:00 pm GMT-7 3 min read
New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it
2026-06-15
www.prnewswire.com
2026-06-15
PR Newswire
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 14, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconduct
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:45 PM EDT
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The TSMC logo is displayed at the Taiwan Semiconductor Manufacturing Company branch and Innovation Museum, highlighting the company branding and signage inside and outside the site in Hsinchu, Taiwan, January 27, 2026. JIMMY BEUNARDEAU/GETTY IMA
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
www.techtimes.com
2026-06-15
Tech Times
By Allen Lee
Published: Jun 14 2026, 20:42 PM EDT
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Tower cranes are seen at the construction site of the Samsung Electronics factory in Pyeongtaek on May 28, 2026. SHIN YONG-JU/AFP VIA GETTY IMAGES
Samsung Electronics expects its foundry business to return to annual profitability in 2028 — late
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
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2026-06-15
digitimes.com
2026-06-15
India sees rising global tech investment as Meta, Reliance and Anthropic deepen AI ties, while EV firms expand, Starlink faces delays, and semiconductor and tablet markets show steady structural growth.
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
Tsang Yow is preparing to broaden its manufacturing footprint in Malaysia, a move that could help global semiconductor supply chains become more regional, resilient, and tariff-proof. The drivetrain systems maker expects trial production at the new plant before the end of 2026, as demand tied to artificial intelligence and advanced chips reshapes sourcing patterns worldwide.
2026-06-15
digitimes.com
2026-06-15
SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for HBM4, a move that underscores mounting pressure on advanced memory suppliers to keep pace with demand from AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology from Taiwan's PSMC, has also drawn a strategic partnership with Dutch lithography equipment supplier ASML.
2026-06-15
digitimes.com
2026-06-15
Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology supplier, expanding into semiconductor materials, passive components and smart acoustics. The new businesses are expected to begin generating revenue in 2026 as product certifications advance, but the company has not yet offered guidance on their revenue impact.
2026-06-15
semiengineering.com
2026-06-15
Ed Sperling
Chip and system designers scramble to leverage existing and future standards as edge AI...
2026-06-15
digitimes.com
2026-06-15
Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward profitability as demand builds across high-performance computing and emerging technology markets.
2026-06-15
digitimes.com
2026-06-15
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading a recovery that is both remarkable in scale and strikingly uneven in distribution. Of the 105 companies tracked, 69 reported positive accumulated year-over-year growth through May, but the top performers are lappi
2026-06-15
digitimes.com
2026-06-15
South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics and SK Hynix accelerated investment in advanced DRAM and high-bandwidth memory (HBM4), generating demand across front-end tools, advanced packaging, and inspection equipment. The shift toward high-end process and packaging capabilities for AI memory has driven new con