Semiconductor News & Analysis Feed
11541 articles
2026-05-30
digitimes.com
2026-05-30
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment spending, and strategic-partner orders may support growth in 2026, even as it continues a gradual shift in its product mix and packaging portfolio.
2026-05-30
digitimes.com
2026-05-30
The global AI boom is pushing supply-chain pressure beyond memory chips and CPUs into optical communications, creating shortages across a less visible but increasingly critical layer of data-center infrastructure.
2026-05-30
digitimes.com
2026-05-30
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.
2026-05-30
digitimes.com
2026-05-30
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty, unfinalized partnerships, and capital intensity risks. The plan, still in preliminary form, depends on future agreements and could face delays, cost overruns, and supply-chain constraints.
2026-05-30
digitimes.com
2026-05-30
At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation Vera Rubin architecture, the company will double its artificial intelligence (AI) supercomputer capacity in Taiwan in 2026. He also thanked supply chain partners, saying he could not do it alone.
2026-05-30
digitimes.com
2026-05-30
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM and NAND supply.
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
digitimes.com
2026-05-30
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing optical communication modules as a future driver of revenue and profits.
2026-05-30
www.digitimes.com
2026-05-30
digitimes
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's...
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2026-05-30
seekingalpha.com
2026-05-30
Seeking Alpha
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2026-05-30
bioengineer.org
2026-05-30
Bioengineer.org
For over fifty years, the relentless pursuit to enhance computing power has centered on shrinking transistors and densely packing them onto silicon chips. This well-established trajectory, famously encapsulated in Moore’s Law, has driven exponential growth in processing abilities. Yet, as components reach nanometer scales, the physical realities of atomic limits and quantum mechanical effects begi
2026-05-30
cryptobriefing.com
2026-05-30
Crypto Briefing
Nvidia, Microsoft, and Arm tease new N1X laptop processors ahead of Computex
The three tech giants are coordinating a 'new era of PC' campaign around Nvidia's first Arm-based laptop chips, with major
2026-05-30
www.theverge.com
2026-05-30
The Verge
NEWS
GADGETS
TECH
Nvidia, Microsoft, and Arm are all teasing Nvidia’s new N1X laptop processors
All eyes area now on Nvidia’s keynote at Computex on Sunday night.
by
Tom Warren
May 30, 2026, 7:03 AM GMT+8
Nvidia CEO Jensen Huang with an RTX laptop at CES 2025. Image: Getty Images
Tom Warren is a senior correspondent and author of Notepad, who has been covering all things Microsoft, PC, and tech
2026-05-30
www.msn.com
2026-05-30
MSN
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2026-05-30
eetimes.com
2026-05-30
Autonomous high-altitude platform stations are getting ready to bridge ground networks and LEO satellites.
2026-05-30
finance.yahoo.com
2026-05-30
Yahoo Finance
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2026-05-30
www.marketbeat.com
2026-05-30
MarketBeat
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2026-05-30
simplywall.st
2026-05-30
simplywall.st
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2026-05-30
www.investing.com
2026-05-30
Investing.com
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2026-05-30
virtualizationreview.com
2026-05-30
Virtualization Review
Cloud providers are facing a two-sided AI cost problem: They have to keep building the infrastructure required to support rising demand, while giving enterprise customers enough controls to keep AI workloads financially manageable.
The result is a new phase in cloud AI, one in which providers are not only competing on model access and performance, but also on cost controls. Prompt caching, contex