Semiconductor News & Analysis Feed
11869 articles
2026-05-27
digitimes.com
2026-05-27
Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also said that TAITRA has allocated the entire Taipei International Convention Center (TICC) exclusivel
2026-05-27
digitimes.com
2026-05-27
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation story: it crystallizes a structural debate about whether AI has permanently transformed memory's earnings profile, a bubble concern as Chinese rivals ramp capacity, and a sharpening geopolitical contest over who con
2026-05-27
digitimes.com
2026-05-27
TSMC chairman and CEO C.C. Wei addressed employees at a company-wide meeting on May 27, making a direct commitment on bonuses after days of backlash over reports of a 15% cut.
2026-05-27
digitimes.com
2026-05-27
Samsung Electronics plans to invest VND39 trillion (approx. US$1.5 billion) in a new semiconductor testing facility in northern Vietnam, according to documents reviewed by Reuters,marking the company's first chip testing plant in the country as global memory demand surges amid the AI boom.
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
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2026-05-27
InsuranceNewsNet
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's...
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2026-05-27
www.digitimes.com
2026-05-27
digitimes
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design.
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2026-05-27
www.donga.com
2026-05-27
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
www.gurufocus.com
2026-05-27
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2026-05-27
www.cnbc.com
2026-05-27
CNBC
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
idahonews.com
2026-05-27
KBOI
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2026-05-27
idahonews.com
2026-05-27
KBOI
BOISE, Idaho (CBS2) — Boise-based Micron Technology has officially crossed into rare territory on Wall Street, briefly topping a $1 trillion market valuation Tuesday after another explosive rally in semiconductor stocks.
Shares of Micron (NASDAQ: MU) surged nearly 20% during Tuesday trading, extending gains from the previous session as investors poured money into artificial intelligence-related c
2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging