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2026-05-04
Fraunhofer IPMS Eyes India For Contract Research and Semiconductor Partnerships
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eetimes.com 2026-05-04 Yashasvini Razdan
Michael Scholles said the interest in India comes from its evolving semiconductor ambitions.
SemiconductorMicroelectronicsSensor TechnologyContract ResearchIndia Semiconductor IndustryPhotonicsMEMSIndustrial Digitalization
2026-05-04
Designing Chips In The Context Of Rapidly Evolving AI
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semiengineering.com 2026-05-04 Ann Mutschler
Long‑running agents, tool-calling LLMs, and multimodal chaos are rewriting edge compu...
AI chip designEdge AIChip architectureComputational performanceMemory hierarchyData movementRAS technologyMultimodal AI
2026-05-04
Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX - GlobeNewswire
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www.globenewswire.com 2026-05-04 GlobeNewswire
2026-05-03
Nvidia’s $1 million problem is getting worse in China - thestreet.com
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www.thestreet.com 2026-05-03 thestreet.com
2026-05-03
AI Servers Create New MLCC Trend: Will It Be the Next HBM? - TradingKey
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www.tradingkey.com 2026-05-03 TradingKey
2026-05-03
TSMC High NA EUV Decision Puts ASML Growth Timing In Focus - Yahoo Finance
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finance.yahoo.com 2026-05-03 Yahoo Finance
2026-05-03
TSMC Delays High NA EUV While Doubling Down On AI Partnerships - Yahoo Finance
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finance.yahoo.com 2026-05-03 Yahoo Finance
2026-05-02
TSMC’s A16 ‘1.6nm’ Node Promises 10% Speed Boost or 20% Power Cut Over 2nm, With Backside Power Hitting Production by Q4 2026 - Wccftech
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wccftech.com 2026-05-02 Wccftech
2026-04-30
Timestamp Drift and Sensor Synchronization: Small Timing Errors, Big Safety Consequences
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eetimes.com 2026-04-30 Nitish Sanghi
Minor timing errors can make an autonomous system act on a world model that is already out of date.
Autonomous SystemsTiming SynchronizationSensor FusionSystem IntegrationSafety MechanismsTiming ErrorsLocalization AccuracyMotion Compensation
2026-04-30
Creating Agentic EDA Methodologies
0.92
semiengineering.com 2026-04-30 Brian Bailey
Current approaches involve multiple tools, vendors, designs, data formats, and abstract...
EDA IndustryArtificial IntelligenceSemiconductor DesignAgentic FlowData AbstractionAI ToolsDesign AutomationChip Architecture
2026-04-29
AI in Design Verification: Where It Works and Where It Doesn’t
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eetimes.com 2026-04-29 Mike Bartley
AI streamlines verification by targeting repetitive tasks but can't replace expert signoff.
AIDesign VerificationSemiconductorICAI-assisted VerificationCoverage AnalysisRegression TestingDebug Efficiency
2026-04-29
STMicro Introduces STM32C5 for Cost-Sensitive Smart Devices
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eetimes.com 2026-04-29 Yashasvini Razdan
Introducing STM32C5 in India, STMicroelectronics explained how the new series targets cost-sensitive applications with improved performance, memory, and connectivity.
MicrocontrollerSTM32C5STMicroelectronicsARM Cortex-M33Ethernet integrationCost-sensitive designIndustrial IoTSmart devices
2026-04-29
How Long Will CAN Stick Around As Rival Networks Speed Up?
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semiengineering.com 2026-04-29 Liz Allan
New in-vehicle networking technology will likely take over as more AI is added, but in ...
Automotive EthernetCAN BusLIN BusSoftware-Defined VehiclesTime-Sensitive NetworkingEthernet BridgeIn-Vehicle NetworksAutonomous Driving
2026-04-28
What the DRAM Crunch Teaches Us About System Design
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eetimes.com 2026-04-28 Avi Baum
Redesign your AI systems for efficiency—escape the DRAM crunch by embracing smaller, smarter models.
DRAM shortageAI system designmemory constraintshigh-bandwidth memoryedge computingAI infrastructuresystem architecturesupply chain risk
2026-04-27
SUSE Launches Industrial Edge Platform Following Losant Acquisition
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eetimes.com 2026-04-27 Yashasvini Razdan
Keith Basil, edge strategy and product leader at SUSE, outlines how the Losant acquisition shapes SUSE Industrial Edge and its deployment model.
Industrial IoTEdge ComputingCloud-NativeSUSELosantIndustrial Edge PlatformOPC UAMQTT
2026-04-27
When Semiconductor Materials Misbehave
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semiengineering.com 2026-04-27 Gregory Haley
The gap between lab performance and fab reality is growing wider as packages grow more ...
Semiconductor materialsAdvanced packagingMaterial behaviorSimulation modelsManufacturing complexityHeterogeneous integrationThermal historyMechanical stress
2026-04-24
What Hormuz Exposed About Our Semiconductor Supply Chain
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eetimes.com 2026-04-24 Kevin Berghoff
The semiconductor industry is facing a reckoning it has postponed for years.
Semiconductor Supply ChainSupply Chain DisruptionHelium ShortageGeopolitical RiskChip ManufacturingLogistics ShockAI Chip DemandCritical Material Dependency
2026-04-23
Telecom Industry Bets on Automation to Tackle AI Squeeze
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eetimes.com 2026-04-23 Pablo Valerio
The telecom sector's survival hinges on rapid software automation to counteract soaring hardware costs fueled by the booming AI demand.
Telecom IndustryArtificial IntelligenceSemiconductor Supply ChainAutomationCapital Expenditure5G6GChip Costs
2026-04-20
YMTC’s NAND Design Surprise Alongside a New Fab
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eetimes.com 2026-04-20 Majeed Ahmad
China’s memory underdog defies sanctions by building a fab that mostly sources equipment, materials, and tools locally.
YMTCNAND FlashSemiconductor ManufacturingChinese ChipsMemory Chips3D NANDDRAMFab Construction
2026-04-17
TSMC Chases Soaring AI Demand
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eetimes.com 2026-04-17 Alan Patterson
TSMC slams the gas to expand chip production for AI giants, but shortages loom.
TSMCAI chipsSemiconductor manufacturingChip capacity3nm process2nm processAI infrastructureChip foundry