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Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a joint venture that will produce glass cores, a key material used in next-generation semiconductor package substrates, the companies said.

Micron breaks ground on Hiroshima expansion to boost AI memory chip production

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digitimes.com 2026-07-06

Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion) investment aimed at increasing production of advanced memory chips, particularly high-bandwidth memory (HBM) used in artificial intelligence (AI) processors.

Samsung Foundry comeback builds as Meta, Anthropic weigh chip deals

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digitimes.com 2026-07-06

Samsung Electronics is trying to turn its foundry business into a bigger supplier of custom chips, with Meta Platforms and Anthropic reportedly considering Samsung for processors after its Tesla win, according to Seoul Economic Daily. The potential orders could push Samsung Foundry toward profitability sooner than expected, with industry sources estimating its medium- to long-term order backlog co

China TPU chipmaker Zhonghao Xinying launches Xuyu AI processor to challenge GPU-based computing

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digitimes.com 2026-07-06

Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize 2.0, a software-hardware integrated AI computing platform built around the chip.

India's chip mission enters harder phase: deciding where to compete

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digitimes.com 2026-07-06

India's plan to sharply expand public funding for semiconductors marks a new phase in its chip ambitions. The harder question is whether New Delhi can now decide where it wants to win first.

Huawei chip chief proposes Tau Law V2 centered on time-based scaling

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digitimes.com 2026-07-06

Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed by internal production claims for Kirin chips and Ascend accelerators. Despite that, he also drew caution because the work remains a preprint, not a peer-reviewed study.

Analysis: Taiwan's semiconductor sector enters 2026 helium crunch, with nearly 90% dependent on Qatar

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digitimes.com 2026-07-06

Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in 2025, up from 46% four years earlier. With war disrupting the Strait of Hormuz, that concentration leaves fabs vulnerable and the outlook uncertain.

China's chip equipment makers ramp up expansion as AI and memory boom fuel domestic demand

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digitimes.com 2026-07-06

China's leading semiconductor equipment manufacturers are accelerating expansion through acquisitions and fundraising, as surging AI investment, memory chip capacity growth, and import substitution combine to create one of the industry's strongest growth cycles in years.

China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

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digitimes.com 2026-07-06

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.

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