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2026-06-03
www.airliquide.com
2026-06-03
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Air Liquide announces milestone investment in South Korea to support SK hynix’s advanced AI memory chip project
Paris, France, June 03, 2026 Press Releases Group
Air Liquide has signed a major long-term contract with SK hynix, a global leader in memory semiconductors. The Group will bring its pioneering solutions to SK hynix’s massive industrial project dedicated to advanced p
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
www.fool.com
2026-06-03
The Motley Fool
Nvidia (
NVDA
0.75%
) and Broadcom (
AVGO
+4.85%
) are the top artificial intelligence (AI) chipmakers by market cap, and both delivered record results in their most recent quarters.
Of the two, Broadcom has been the better investment in 2026 and over the last year, but Nvidia is the winner if you look further back. Its five-year and 10-year returns are much higher than Broadcom's.
Let's see how
2026-06-03
www.thestreet.com
2026-06-03
thestreet.com
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2026-06-03
www.ad-hoc-news.de
2026-06-03
AD HOC NEWS
Infineon’s, New
Infineon’s New Silicon Carbide Chips Target the Power Grid Inside AI Data Centers
03.06.2026 - 10:00:53 | boerse-global.de
Infineon introduces 750V/1200V CoolSiC JFETs for AI data center power infrastructure, enabling solid-state circuit breakers and hot-swap designs; shares surged 129% YTD.
Unity setzt auf KI: Von Spielen bis zur Fabrik - Bild: über boerse-global.de
Infineon is
2026-06-03
www.ideal-investisseur.fr
2026-06-03
Idéal Investisseur
Air Liquide Signs Major Contract with SK hynix to Support HBM Chip Production in Korea
On Wednesday, the French group announced the construction of a dedicated nitrogen production unit for SK hynix's HBM memory chip packaging plant in Cheongju. This long-term major contract represents the first major integration project following the acquisition of DIG Airgas earlier this year.
PUBLISHED ON JUN
2026-06-03
eetimes.com
2026-06-03
NSTC Minister Wu shares Taiwan's four-pillar shift from chipmaker to AI enabler.
2026-06-03
www.communicationstoday.co.in
2026-06-03
Communications Today
COMPANY NEWS
Huang warns of chip shortage as Chey vows to double production
June 03, 2026
NVIDIA CEO Jensen Huang warned that the global semiconductor supply shortage will persist for the time being. SK Group Chairman Chey Tae-won, a key partner of NVIDIA, stated, “We will expand production capacity twofold within five years.” Starting from Huang’s visit to Korea on the 5th, NVIDIA and Korean com
2026-06-03
news.google.com
2026-06-03
Longbridge
2026-06-03
www.digitimes.com
2026-06-03
digitimes
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary, combining two processor IP portfolios into a single offering that...
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2026-06-03
www.heygotrade.com
2026-06-03
Gotrade
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2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
evertiq.com
2026-06-03
Evertiq
© nvidia
Business | June 03, 2026
Nvidia, TSMC use AI to advance chip design and manufacturing
Evertiq
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.
Nvidia has announced that TSMC is using Nvidia accelerated computing and AI to advance semiconductor design and m
2026-06-03
www.ynetnews.com
2026-06-03
Ynetnews
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Intel tries to loosen Nvidia’s AI grip with chips that keep computing off the public cloud
At Computex 2026, Intel unveiled an ambitious AI chip offensive spanning PCs, robotics and edge devices, promoting local AI ov
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
kalkinemedia.com
2026-06-03
Kalkine Media
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2026-06-03
simplywall.st
2026-06-03
simplywall.st
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2026-06-03
www.msn.com
2026-06-03
MSN
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2026-06-03
www.digitimes.com
2026-06-03
digitimes
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and...
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